Semiconductor module
First Claim
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1. A semiconductor module comprising:
- a resin package including a first surface, and a second surface which is different from the first surface;
a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;
a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and
a conductive film covering at least the second surface of the resin package;
wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film.
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Abstract
A semiconductor module includes a resin package, a conductive film formed on the resin package, and a lead partially covered by the resin package. The lead includes an inner portion covered by the resin package, and an outer portion projecting from the resin package. A semiconductor element is mounted to the inner portion of the lead. The inner portion of the lead includes a plurality of extensions for grounding, and each of the extensions has a front end held in contact with the conductive film.
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Citations
17 Claims
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1. A semiconductor module comprising:
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a resin package including a first surface, and a second surface which is different from the first surface;
a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;
a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and
a conductive film covering at least the second surface of the resin package;
wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film. - View Dependent Claims (2, 3, 4, 5)
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6. A semiconductor module comprising:
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a resin package;
a conductor including an inner portion covered by the resin package and an outer portion projecting from the resin package; and
a semiconductor element mounted to the inner portion of the conductor and covered by the resin package;
wherein the inner portion of the conductor is formed with a recess for accommodating the semiconductor element, the recess being defined by a bottom portion to which the semiconductor element is mounted and a side wall surrounding the semiconductor element, the side wall being tapered toward the bottom portion. - View Dependent Claims (7, 8, 9, 10)
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11. A semiconductor module comprising:
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a resin package including a first surface, and a second surface which is different from the first surface;
a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;
a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and
a conductive film covering at least the second surface of the resin package;
wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film; and
wherein the inner portion of the lead is formed with a recess for accommodating the semiconductor element. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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Specification