Semiconductor module

• US 20050073018A1
• Filed: 07/27/2004
• Published: 04/07/2005
• Est. Priority Date: 07/28/2003
• Status: Active Grant

• Current Assignee: ROHM Co., Ltd.
• Original Assignee: ROHM Co., Ltd.
• Inventors: Yano, Shinji, Kumura, Naoki, Yamasaki, Tetsuya
• Granted Patent: US 7,071,523 B2
• Time in Patent Office: Days
• US Class Current: 257/433
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02164 for shielding light, e.g. light blocking layers, cold shields for infrared detectors
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device

Abstract

A semiconductor module includes a resin package, a conductive film formed on the resin package, and a lead partially covered by the resin package. The lead includes an inner portion covered by the resin package, and an outer portion projecting from the resin package. A semiconductor element is mounted to the inner portion of the lead. The inner portion of the lead includes a plurality of extensions for grounding, and each of the extensions has a front end held in contact with the conductive film.

Claims

1. A semiconductor module comprising:

a resin package including a first surface, and a second surface which is different from the first surface;

a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;

a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and

a conductive film covering at least the second surface of the resin package;

wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film.

2. The module according to claim 1, wherein the extension projects from the second surface of the resin package.

3. The module according to claim 1, wherein the semiconductor element comprises a light receiving element having a light receiving surface, the light receiving surface being formed with a mesh-like conductor pattern.

4. The module according to claim 3, wherein the resin package includes a lens surface for converging light onto the light receiving element, and wherein the conductive film has light shielding property.

5. The module according to claim 1, further comprising a connection strip provided on the first surface of the resin package and connected to the conductive film, the connection strip being held in contact with the lead while surrounding the lead.

6. A semiconductor module comprising:

a resin package;

a conductor including an inner portion covered by the resin package and an outer portion projecting from the resin package; and

a semiconductor element mounted to the inner portion of the conductor and covered by the resin package;

wherein the inner portion of the conductor is formed with a recess for accommodating the semiconductor element, the recess being defined by a bottom portion to which the semiconductor element is mounted and a side wall surrounding the semiconductor element, the side wall being tapered toward the bottom portion.

7. The module according to claim 6, wherein the recess has a depth which is no smaller than a thickness of the semiconductor element.

8. The module according to claim 6, wherein the bottom portion and the side wall of the recess have substantially the same thickness.

9. The module according to claim 6, wherein the semiconductor element comprises a light receiving element, and wherein the side wall of the recess includes a reflective surface for reflecting light toward the light receiving element.

10. The module according to claim 9, further comprising an integrated circuit element for processing a signal outputted from the light receiving element, and a resin material covering the integrated circuit element, the resin material being covered by the resin package and having light shielding property which is higher than light shielding property of the resin package.

11. A semiconductor module comprising:

a resin package including a first surface, and a second surface which is different from the first surface;

a lead including an inner portion covered by the resin package and an outer portion projecting from the first surface of the resin package;

a semiconductor element mounted to the inner portion of the lead and covered by the resin package; and

a conductive film covering at least the second surface of the resin package;

wherein the inner portion of the lead includes an extension extending toward the second surface of the resin package, the extension being held in contact with the conductive film; and

wherein the inner portion of the lead is formed with a recess for accommodating the semiconductor element.

12. The module according to claim 11, wherein the extension projects from the second surface of the resin package.

13. The module according to claim 11, further comprising a connection strip provided on the first surface of the resin package and connected to the conductive film, the connection strip being held in contact with the lead while surrounding the lead.

14. The module according to claim 11, wherein the recess has a depth which is no smaller than a thickness of the semiconductor element.

15. The module according to claim 11, wherein the recess is defined by a bottom portion to which the semiconductor element is mounted and a sidewall surrounding the semiconductor element, the side wall being tapered toward the bottom portion.

16. The module according to claim 15, wherein the side wall of the recess includes a reflective surface for reflecting light toward the semiconductor element.

17. The module according to claim 11, further comprising an integrated circuit element for processing a signal outputted from the semiconductor element, and a resin material covering the integrated circuit element, the resin material being covered by the resin package and having light shielding property which is higher than light shielding property of the resin package.