Integrally packaged imaging module
First Claim
1. An integrally packaged imaging module, comprising:
- an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate;
wafer-level packaging enclosing the IC, and including;
a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths; and
a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device, wherein a depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.
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Abstract
An integrally packaged imaging module includes an integrated circuit (IC), including an image sensing device formed on a semiconductor substrate, and wafer level packaging enclosing the IC. The wafer level packaging includes a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths, and a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device. A depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device.
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Citations
20 Claims
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1. An integrally packaged imaging module, comprising:
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an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate;
wafer-level packaging enclosing the IC, and including;
a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths; and
a first spacing structure providing a cavity between an inner surface of the transparent enclosure portion and the image sensing device, wherein a depth of the cavity is configurable along an axis perpendicular to the semiconductor substrate to control a distance between an outer surface of the transparent enclosure portion and the image sensing device. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of fabricating integrally packaged imaging modules, the method comprising:
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forming an array of integrated circuits (ICs) on a semiconductor wafer, each IC including an image sensing device;
integrally packaging the array of ICs, the packaging step comprising;
enclosing the array of ICs on a first side with a transparent enclosure layer so that each image sensing device of each IC in the array can detect an image consisting of a desired range of wavelengths through the transparent enclosure layer;
aligning and attaching an array of lens supports to another packaging layer such that lenses used with the array of lens supports are optically aligned with corresponding image sensing devices; and
dicing the packaged array of ICs into individual integrally packaged imaging modules. - View Dependent Claims (9, 10)
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11. An integrally packaged imaging module, comprising:
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an integrated circuit (IC) including an image sensing device formed on a semiconductor substrate;
wafer-level packaging enclosing the IC, and including;
a transparent enclosure portion adapted to permit image acquisition of an image by the image sensing device over a desired range of wavelengths;
a first lens support adapted to suspend a first lens so that the first lens directs the image onto the image sensing device; and
a first spacing structure adapted to provide a spacing between the suspended first lens and the image sensing device. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification