Heat sinks

• US 20050077615A1
• Filed: 10/10/2003
• Published: 04/14/2005
• Est. Priority Date: 10/10/2003
• Status: Active Grant

• Current Assignee: LG Chem Limited (LG Corporation)
• Original Assignee: E. I. du Pont de Nemours and Company (Corteva, Inc.)
• Inventors: Yu, Gang, Wang, Jian
• Granted Patent: US 7,109,520 B2
• Time in Patent Office: Days
• US Class Current: 257/706
• CPC Class Codes: H01L 23/367 Cooling facilitated by shape of device H01L23/38, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H10K 50/87 Arrangements for heating or cooling
• CPC Class Codes: H10K 59/8794 Arrangements for heating and cooling
• CPC Class Codes: H10K 71/00 Manufacture or treatment specially adapted for the organic devices covered by this subclass

Abstract

An aspect of the present invention provides a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a thickness no greater than 9 mm. In another embodiment, a heat sink has a side with a pattern that extends at least partially through a thickness of the heat sink. The heat sink also has a ratio of area:thickness, as seen from a plan view, of at least 500:1 when the area and thickness are expressed in units of mm² and mm, respectively.

Claims

1. A heat sink having a side with a pattern that extends at least partially through a thickness of the heat sink, wherein:

the heat sink has a thickness no greater than 9 mm; and

the heat sink is attached to an array within an organic electronic device.

2. The heat sink of claim 1, wherein at least one side of the heat sink has a pattern that extends partially, but not completely through the heat sink.

4. The heat sink of claim 2, wherein the heat sink has a thickness no greater than 500 microns.

5. The heat sink of claim 2, wherein the heat sink lies within 90 μ

m of an organic active layer of the organic electronic device.

6. The heat sink of claim 2, wherein the side with the pattern has a black surface.

7. The heat sink for claim 2, wherein the organic electronic device is designed to be at least one of an outdoor display and a lighting panel.

8. The heat sink of claim 1, wherein the side with the pattern is black.

3. (cancelled)

9. A heat sink having a side with a pattern that extends at least partially through a thickness of the heat sink, wherein:

the heat sink has a ratio of area;

thickness, as seen from a plan view, of at least 500;

1 when the area and thickness are expressed in units of mm² and mm, respectively; and

the heat sink is attached to an array within an organic electronic device.

10. The heat sink of claim 9, wherein at least one side of the heat sink has a pattern that extends partially, but not completely through the heat sink.

12. The heat sink of claim 10, wherein the heat sink has a thickness no greater than 500 microns.

13. The heat sink of claim 10, wherein the ratio of area:

thickness is at least 11,000;

1.

14. The heat sink of claim 10, wherein the heat sink lies within 90 μ

m of an organic active layer of the organic electronic device.

15. The heat sink for claim 14, wherein the organic electronic device is designed to be at least one of an outdoor display and a lighting panel.

16. The heat sink of claim 10, wherein the side with the pattern has a black surface.

11. (cancelled)