Package for housing an optoelectronic assembly
6 Assignments
0 Petitions
Accused Products
Abstract
A package for housing an optoelectronic device and an integrated circuit is disclosed. The package includes an insulating base having an upper surface. The optoelectronic device and the integrated circuit are mounted to the upper surface of the insulating base. The package also includes a metal sealing member having a top wall and a bottom wall. The bottom wall of the metal sealing member is attached to the upper surface of the insulating base. The package further includes a metal cover having a rim located at a bottom portion thereof. The rim of the metal cover is adapted to attach to the top wall of the metal sealing member to thereby hermetically seal the metal cover to the insulating base.
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Citations
63 Claims
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1-30. -30. (canceled)
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31. A package configured to house an optoelectronic assembly, the package comprising:
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an insulating base having an upper surface;
an optoelectronic device mounted to the upper surface of the insulating base;
a first metal member comprising a bottom wall and a top wall, the bottom wall of the first metal member being attached to the upper surface of the insulating base; and
a metal cover having a rim located at a bottom portion thereof, the rim of the metal cover being configured to attach to the top wall of the first metal member to hermetically seal the metal cover to the insulating base. - View Dependent Claims (32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48)
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49. A method for providing a hermetic enclosure, the method comprising:
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mounting an optoelectronic device to an upper surface of an insulating base;
attaching a bottom wall of a first metal member to the upper surface of the insulating base;
positioning a metal cover over the optoelectronic device, the metal cover comprising a rim at a bottom portion thereof; and
attaching the rim of the metal cover to a top wall of the first metal member to hermetically enclose the optoelectronic device. - View Dependent Claims (50, 51, 52, 53, 54, 55, 56, 57)
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58. An automated process for manufacturing a package, the package being configured to house an optoelectronic assembly, the automated process comprising:
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providing an insulating substrate having an upper surface and a lower surface, the insulating substrate comprising a plurality of vias formed through the upper and lower surfaces of the insulating substrate, and the plurality of vias being filled with a conductive material;
forming a metallization layer on each of the upper and lower surfaces of the insulating substrate;
attaching a metal sealing ring to the metallization layer formed on the upper surface of the insulating substrate;
mounting the optoelectronic assembly to the metallization layer formed on the upper surface of the insulating substrate and within an inner region of the metal sealing ring, the optoelectronic assembly comprising at least one optical device and at least one integrated circuit electrically coupled to the at least one optical device;
aligning a metal cap over the optoelectronic assembly; and
sealing the metal cap to the insulating substrate to hermetically enclose the optoelectronic assembly. - View Dependent Claims (59)
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60. A packaged optical module, comprising:
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a base formed of an electrically insulating material and having at least a first surface and a second surface, an optical device being mounted to the base at the first surface;
a sealing member formed of an electrically conducting material and attached to the base, the sealing member extending along a perimeter of the base with the optical device being located within an inner region of the sealing member;
a heat dissipating device attached to the second surface of the base; and
a cover formed of the electrically conducting material, the cover being configured to attach to the sealing member on the base to provide a hermetic enclosure for the optical device. - View Dependent Claims (61, 62, 63)
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Specification