Cantilever microprobes for contacting electronic components and methods for making such probes

• US 20050179458A1
• Filed: 01/03/2005
• Published: 08/18/2005
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Bang, Christopher A., Kruglick, Ezekiel J. J., Chen, Richard T., Lembrikov, Pavel B.
• Granted Patent: US 7,265,565 B2
• Time in Patent Office: Days
• US Class Current: 324/755.70
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Claims

1. A cantilever probe for making contact with an electronic circuit element, comprising:

at least one base element which is bonded to a substrate;

a support element which extends from a portion of the base element

a cantilever portion which has a proximal and distal end, wherein the proximal end contacts the support element, and wherein a footprint of the at least one base element underlies at least a portion of the cantilever portion; and

a tip portion which is located at or near a distal end of the cantilever portion which may be used to make electrical contact with a pad on an electronic circuit element.

2. The cantilever probe of claim 1 wherein the portion of the cantilever portion comprises at least 25% of the cantilever portion.

3. The cantilever probe of claim 2 wherein the at least 25% comprises at least 50%.

4. The cantilever probe of claim 2 wherein the at least 25% comprises at least 75%.

15. The cantilever probe of claim 1 additionally comprising at least one of:

(1) multiple beam elements, or (4) a narrowing of a beam portion of the probe with distance from a support post.

5. An array of cantilever probes for making contact with an electronic circuit element, comprising a plurality of cantilever probes positioned relative to each other wherein interlaced bonding locations are used to connect adjacent probes to a substrate.

6. A probe assembly for making electric contact with an electronic circuit element, comprising:

a substrate including at least one structure;

at least one probe comprising;

a contact tip portion;

a compliant portion functionally attached to the tip portion; and

a base portion functionally attached to the compliant portion, wherein the base portion is configured to mate with and be at least partially mechanically constrained by its physical configuration and the physical configuration of the at least one structure on the substrate.

7. The probe assembly of claim 6 wherein the probe comprises a cantilever probe.

8. The probe assembly of claim 7 wherein the base portion and at least one structure are configured for mechanical interlocking by linear motion between the base and the probe in a direction that is substantially parallel to a plane of a surface of the substrate.

9. The probe assembly of claim 8 wherein the base and/or the at least one structure comprising a mechanism that may lock the base and structure mechanically together when the base and structure are properly positioned relative to each other.

10. The probe assembly of claim 9 wherein the locking occurs automatically when proper positioning is achieved.

11. The probe assembly of claim 9 wherein the locking may be made to occur manually when proper positioning is achieved.

12. The probe assembly of claim 8, wherein after a locking, the base and structure may be unlocked from each other without damage to the base such that it is possible to insert a replacement probe into the base and have the replacement probe locked into position.

13. The probe assembly of claim 6, wherein the at least one probe comprises a plurality of probes.

14. A cantilever probe for making contact with an electronic circuit element, comprising:

at least one base element which is bonded to a substrate;

a support element which extends from a portion of the base element

a cantilever portion which has a first region and a second region, wherein the first region contacts the support element, and wherein a footprint of the at least one base element underlies at least a portion of the cantilever portion; and

a tip portion which is held by the cantilever portion at the second region which may be used to make electrical contact with a pad on an electronic circuit element.