Low thermal resistance light emitting diode
First Claim
Patent Images
1. A light emitting diode (LED) package, comprising:
- a metallic lead frame having positive lead portion and negative lead portion insulated from one another;
a mold of insulating material wrapped over said metallic lead frame, having a cavity where sections of said metallic lead portions are not covered by said insulating material;
an optical lens formed by injection molding, transfer molding, or other methods, over said cavity to combine with said mold;
at least one LED chip flip-chip bonded on a submount which has printed circuit to couple said LED chip with said metallic lead portions; and
transparent material having an index of refraction greater than 1.3 and a transmission coefficient greater than 80% filling the space between the lens and the LED chips.
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Accused Products
Abstract
A light emitting diode (LED) includes a LED chip, which can transfer electrical power to electric-magnetic wave. A set of lead frame is enclosed by electrical isolator material to form a cavity. An optics lens seats on top of the cavity and is bonded to said electrical isolator material. A submount to carry said LED chip is soldered or adhered to the lead frame and forms the electrical contact from said LED chip to lead frame. A high transparency material is utilized to enclosed the LED chip.
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Citations
9 Claims
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1. A light emitting diode (LED) package, comprising:
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a metallic lead frame having positive lead portion and negative lead portion insulated from one another;
a mold of insulating material wrapped over said metallic lead frame, having a cavity where sections of said metallic lead portions are not covered by said insulating material;
an optical lens formed by injection molding, transfer molding, or other methods, over said cavity to combine with said mold;
at least one LED chip flip-chip bonded on a submount which has printed circuit to couple said LED chip with said metallic lead portions; and
transparent material having an index of refraction greater than 1.3 and a transmission coefficient greater than 80% filling the space between the lens and the LED chips. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A LED package, comprising:
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a metallic lead frame having positive lead portion and negative lead portion insulated from one another;
a mold of insulating material wrapped over said metallic lead frames, having a cavity where sections of said metallic lead portions are not covered by said insulating material;
at least one LED flip-chip bonded on a submount which has printed circuit to couple said LED chip with said metallic lead portions; and
transparent material having an index of refraction greater than 1.3 and a transmission coefficient greater than 80% wrapping around said LED chip.
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9. A LED package, comprising:
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a metallic lead frame having positive lead portion and negative lead portion insulated from one another;
a mold of insulating material wrapped over said metallic lead portions, having a cavity where sections of said metallic lead portions are not covered by said insulating material;
at least one LED chip bonded through high conductivity material with conductivity coefficient of greater than 1 W/m °
K on a submount, which has printed circuit to couple said LED chip with said metallic lead portions; and
transparent material with an index of refraction greater than 1.3 and transmission coefficient greater 80% wrapping around said LED chip.
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Specification