Surface mountable light emitting diode assemblies packaged for high temperature operation
First Claim
Patent Images
1. A LED assembly adapted for surface mounting and high temperature operation, the LED assembly comprising:
- a thermally conducting base;
one or more electrically insulating layers overlying the thermally conducting base and defining a surface cavity, wherein the electrically insulating layers include one or more terminals; and
one or more LED die disposed at least partially within the surface cavity, wherein the one or more LED die are in thermal contact with the thermally conducting base, and electrically connected to the one or more terminals of the one or more insulating layers, wherein a bottom surface of the LED assembly includes a thermally conductive region in thermal contact with the thermally conducting base, for spreading heat transmitted to the base from the one or more LED die.
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Abstract
Light emitting diode (LED) assemblies packaged for high temperature operation and surface mounting. In particular, the LED assemblies according to the present invention are constructed to include a thermally conducting base and an optically efficient cavity that provides protection for the LED assembly and maximizes light extraction. The LED assemblies are particularly adapted for easy and efficient surface mounting or bolt down assembly mounting in high temperature environments.
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Citations
24 Claims
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1. A LED assembly adapted for surface mounting and high temperature operation, the LED assembly comprising:
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a thermally conducting base;
one or more electrically insulating layers overlying the thermally conducting base and defining a surface cavity, wherein the electrically insulating layers include one or more terminals; and
one or more LED die disposed at least partially within the surface cavity, wherein the one or more LED die are in thermal contact with the thermally conducting base, and electrically connected to the one or more terminals of the one or more insulating layers, wherein a bottom surface of the LED assembly includes a thermally conductive region in thermal contact with the thermally conducting base, for spreading heat transmitted to the base from the one or more LED die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 16)
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11. A device comprising:
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a heat sink;
an apertured board overlying the heat sink; and
one or more LED assemblies mounted on the apertured board and thermally coupled to the heat sink by a heat spreader, wherein each of the one or more LED assemblies includes;
a thermally conducting base, one or more electrically insulating layers overlying the thermally conducting base and defining a surface cavity, wherein the electrically insulating layers include one or more terminals, and one or more LED die disposed at least partially within the surface cavity, wherein the one or more LED die are in thermal contact with the thermally conducting base and electrically connected to the one or more terminals of the one or more insulating layers, wherein a bottom surface of the LED assembly includes a thermally conductive region in thermal contact with the thermally conducting base, for spreading heat transmitted to the base from the one or more LED die. - View Dependent Claims (12, 13, 14, 15)
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17. A device comprising:
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an apertured board;
one or more LED assemblies mounted underlying the apertured board, wherein each of the one or more LED assemblies includes;
a thermally conducting base, one or more electrically insulating layers overlying the thermally conducting base and defining a surface cavity, wherein the electrically insulating layers include one or more terminals, and one or more LED die disposed at least partially within the surface cavity, wherein the one or more LED die are in thermal contact with the thermally conducting base and electrically connected to the one or more terminals of the one or more insulating layers, wherein a bottom surface of the LED assembly includes a thermally conductive region in thermal contact with the thermally conducting base, for spreading heat transmitted to the base from the one or more LED die; and
a heat sink thermally coupled to the bottom surface of each of the one or more LED assemblies. - View Dependent Claims (18, 19, 20)
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21. A device comprising:
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an apertured board;
a heat sink; and
one or more LED assemblies mounted between the apertured board and the heat sink, wherein each of the one or more LED assemblies includes;
a metal base including one or more holes, one or more ceramic layers overlying the metal base and defining a surface cavity, wherein the ceramic layers include one or more terminals, and one or more LED die disposed at least partially within the surface cavity, wherein the one or more LED die are in thermal contact with the metal base and electrically connected to the one or more terminals of the one or more ceramic layers, wherein a bottom surface of the LED assembly includes a thermally conductive region in thermal contact with the metal base, for spreading heat transmitted to the base from the one or more LED die. - View Dependent Claims (22, 23, 24)
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Specification