Methods for packaging image sensitive electronic devices
First Claim
1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
- mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad of said electronic device with a nonconductive material dispensed in liquid form;
covering a surface of said electronic device with a transparent lid;
curing the liquid nonconductive material to at least a semisolid state; and
retaining said transparent lid by an adhesive interface with said nonconductive material.
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Accused Products
Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.
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Citations
9 Claims
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1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad of said electronic device with a nonconductive material dispensed in liquid form;
covering a surface of said electronic device with a transparent lid;
curing the liquid nonconductive material to at least a semisolid state; and
retaining said transparent lid by an adhesive interface with said nonconductive material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification