Method of clearing electrical contact pads in thin film sealed OLED devices
First Claim
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1. A process of cleaning wire bond pads associated with OLED devices, comprising the steps of depositing on said wire bond pads one or more layers of ablatable material, and ablating said one or more layers with a laser, thereby exposing a clean wire bond pad.
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Abstract
A process of cleaning wire bond pads associated with OLED devices, including the steps of depositing on the wire bond pads one or more layers of ablatable material, and ablating the one or more layers with a laser, thereby exposing a clean wire bond pad.
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Citations
1 Claim
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1. A process of cleaning wire bond pads associated with OLED devices, comprising the steps of depositing on said wire bond pads one or more layers of ablatable material, and ablating said one or more layers with a laser, thereby exposing a clean wire bond pad.
Specification