High-temperature reduced size manometer
First Claim
Patent Images
1. A pressure transducer, comprising:
- A. a pressure sensor configured to operate above a first temperature;
B. one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components being configured to operate below a second temperature, the first temperature being greater than the second temperature; and
C. a solid-state heat pump disposed between the pressure sensor and the one or more electronic components, the solid-state heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor when the one or more electronic components are operating below the second temperature and the pressure sensor is operating above the first temperature.
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Abstract
A pressure-sensing device and method for making and using such device having a temperature differential between two portions of the device is disclosed. A solid-state heat pump, such as a thermo-electric cooler (TEC), is used to pump heat from a cold portion to a hot portion of the device. A pressure sensor sensing the pressure of a hot fluid is disposed in the hot portion of the device, and sensor electronics are disposed in the cold portion of the device.
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Citations
29 Claims
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1. A pressure transducer, comprising:
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A. a pressure sensor configured to operate above a first temperature;
B. one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components being configured to operate below a second temperature, the first temperature being greater than the second temperature; and
C. a solid-state heat pump disposed between the pressure sensor and the one or more electronic components, the solid-state heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor when the one or more electronic components are operating below the second temperature and the pressure sensor is operating above the first temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A pressure-sensing device, comprising:
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A. a housing;
B. sensor electronics disposed within a first portion of the housing;
C. a pressure sensor disposed within a second portion of the housing; and
D. a solid-state heat pump disposed between the first and second portions of the housing, the solid state heat pump configured to transfer heat from a first face of the solid state heat pump, proximal to the first portion of the housing, to a second face of the solid state heat pump, proximal to the second portion of the housing. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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- 19. A method of operating a pressure transducer, the transducer including a pressure sensor and sensor electronics disposed within a housing, the method comprising transferring heat from the sensor electronics to the pressure sensor when the sensor electronics are cooler than the pressure sensor.
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22. A method of operating a pressure transducer, the transducer including a housing, a pressure sensor disposed within a first portion of the housing, and sensor electronics disposed within a second portion of the housing, the method comprising transferring heat from the second portion of the housing to the first portion of the housing when the second portion of the housing is cooler than the first portion of the housing.
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23. A pressure-sensing device, comprising:
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A. a housing;
B. a thermal channel substantially dividing the housing into a first portion and a second portion;
C. sensor electronics disposed within the first portion of the housing;
D. a capacitive pressure sensor disposed within the second portion of the housing; and
E. a thermoelectric cooler configured to transfer heat from a first face of the thermoelectric cooler, proximal to the first portion of the housing, to a second face of the thermoelectric cooler, proximal to the second portion of the housing. - View Dependent Claims (24, 25, 26, 27, 28, 29)
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Specification