Micro-electromechanical systems switch and method of fabricating the same
First Claim
1. A micro-electromechanical systems switch comprising:
- a substrate;
a signal line formed on the substrate and having a predetermined opening portion;
at least one supporting frame each formed on the substrate at both sides of the signal line;
a ground line formed on the substrate between the supporting frame and the signal line;
a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward;
a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and
a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.
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Accused Products
Abstract
Provided is a micro-electromechanical systems switch for controlling signal delivery in a high frequency band wireless communication and a radio frequency (RF) system and, comprising: a substrate; a signal line formed on the substrate and having a predetermined opening portion; at least one supporting frame each formed on the substrate at both sides of the signal line; a ground line formed on the substrate between the supporting frame and the signal line; a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward; a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate.
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Citations
15 Claims
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1. A micro-electromechanical systems switch comprising:
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a substrate;
a signal line formed on the substrate and having a predetermined opening portion;
at least one supporting frame each formed on the substrate at both sides of the signal line;
a ground line formed on the substrate between the supporting frame and the signal line;
a moving plate fixed to the supporting frame at both sides thereof, the moving plate being movable upward and downward;
a switching unit positioned on the moving plate, the switching unit comprising contact means for connecting the opened signal line; and
a supporting layer for supporting the moving plate and the switching unit, wherein the supporting layer comprises a support protrusion portion for maintaining a distance from the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of fabricating a micro-electromechanical systems switch, comprising:
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a) forming a signal line having a predetermined opening portion, a supporting frame positioned at both sides of the signal line, and a ground line positioned between the supporting frame and the signal line on a substrate, respectively;
b) forming a sacrificial layer having a predetermined thickness over the surface;
c) forming grooves in the sacrificial layer at portions where ends of the signal line reach, respectively, and then, forming contact portions in the grooves;
d) forming a hole in the sacrificial layer to expose the substrate between the opened signal lines, a support protrusion portion in the hole, and a supporting layer on the sacrificial layer other than the contact portion;
e) forming a moving plate over the supporting frame and the sacrificial layer and over the supporting layer;
f) forming a switching unit over the supporting layer and the contact portion inside the moving plate; and
g) removing the sacrificial layer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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Specification