Gas supply member and plasma processing apparatus

• US 20060196604A1
• Filed: 03/02/2006
• Published: 09/07/2006
• Est. Priority Date: 03/02/2005
• Status: Active Grant

• Current Assignee: Tokyo Electron Limited
• Original Assignee: Tokyo Electron Limited
• Inventors: Moriya, Tsuyoshi, Murakami, Takahiro
• Granted Patent: US 7,416,635 B2
• Time in Patent Office: Days
• US Class Current: 156/345.34
• CPC Class Codes: C23F 4/00 Processes for removing metallic material from surfaces, not provided for in group C23F1/00 or C23F3/00
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

A gas supply member is disposed in a chamber of a plasma processing apparatus and has a planar surface facing an inner space of the chamber and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes to the inner space. An outer periphery portion of each gas hole at the planar surface has a slant surface formed to correspond to a flow of the gas injected through each gas hole. Further, the slant surface includes at least any one of a flat surface and a curved surface. An angle formed between the slant surface and the planar surface is equal to or greater than that formed between the planar surface and a distribution of the gas injected through each gas hole.

Claims

1. A gas supply member, which is disposed in a chamber of a plasma processing apparatus and has a planar surface facing an inner space of the chamber and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes to the inner space,

wherein an outer periphery portion of each gas hole at the planar surface has a slant surface formed to correspond to a flow of the gas injected through each gas hole, and

wherein the slant surface includes at least any one of a flat surface and a curved surface.

2. The gas supply member of claim 1, wherein the slant surface includes a coned surface, a spherical surface, a parabolic surface, or a combination thereof.

3. The gas supply member of claim 1, wherein an angle formed between the slant surface and the planar surface is equal to or greater than that formed between the planar surface and a distribution of the gas injected through each gas hole.

4. The gas supply member of claim 1, wherein an angle formed between the slant surface and the planar surface is 20°

or greater.

5. The gas supply member of claim 1, wherein the slant surface has an n-fold rotation symmetry (n=2˜

∞

) about a central axis of each gas hole.

6. The gas supply member of claim 1, wherein a surface between neighboring gas holes is formed of only the slant surface.

13. The gas supply member of claim 2, wherein a surface between neighboring gas holes is formed of only the slant surface.

14. The gas supply member of claim 4, wherein a surface between neighboring gas holes is formed of only the slant surface.

7. A gas supply member, which is disposed in a chamber of a plasma processing apparatus and has a planar surface facing an inner space of the chamber and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes to the inner space,

wherein outer periphery portions of neighboring gas holes at the planar surface are connected to form grooves,

wherein an outer periphery portion of each groove at the planar surface has a slant surface to correspond to a flow of the gas injected through each gas hole, and the grooves are concentrically formed on the planar surface, and

wherein the slant surface includes at least any one of a flat surface and a curved surface.

8. The gas supply member of claim 7, wherein the slant surface includes a cone surface, a spherical surface, a parabolic surface, or a combination thereof.

9. A gas supply member, disposed in a chamber of a plasma processing apparatus, comprising:

a planar surface facing an inner space of the chamber; and

gas channels, opened at the planar surface, for supplying a gas into the inner space,

wherein an outer periphery portion of each gas channel at the planar surface has a slant surface to correspond to a flow of the gas injected through each gas channel, and

wherein the slant surface includes at least any one of a flat surface and a curved surface.

10. The gas supply member of claim 9, wherein the slant surface includes a cone surface, a spherical surface, a parabolic surface, or a combination thereof.

11. A plasma processing apparatus, which includes a chamber for accommodating therein an object to be processed;

and a gas supply member, disposed in the chamber, for supplying a gas into an inner space of the chamber,

wherein the gas supply member has a planar surface facing the inner space, and a plurality of gas holes bored in the planar surface to supply a gas through the gas holes into the inner space; and

an outer periphery portion of each gas hole at the planar surface has a slant surface to correspond to a flow of the gas injected through the gas hole, and

wherein the slant surface includes at least any one of a flat surface and a curved surface.

12. The plasma processing apparatus of claim 11, wherein the slant surface includes a cone surface, a spherical surface, a parabolic surface, or a combination thereof.