Transferring die(s) from an intermediate surface to a substrate
First Claim
1. A method for transferring a plurality of integrated circuit dies from a die plate to a substrate, comprising:
- (a) receiving a die plate that has a first surface having a die attached thereto, wherein the die covers a corresponding hole through the die plate;
(b) positioning a transparent planar body against a second surface of the die plate;
(c) positioning the first surface of the die plate and the substrate to be adjacent to each other such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and
(d) applying a stimulus through the transparent planar body to a material filling the hole in the die plate to cause the die to be released from the die plate to come into contact with the contact area.
1 Assignment
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Accused Products
Abstract
Dies that are attached to a die plate can be transferred to a substrate. For example, holes in the die plate can be filled with an expandable material. A stimulus source, such as a laser beam/laser light can be directed to the material in a hole, causing the material to expand. Expansion of the material can cause a die that is covering the hole to be released from the die plate to come into contact with a substrate. A mask can be used to prevent the material in a hole from being expanded by the stimulus source. In another example, a pin plate is used to release a die from the die plate. Pins of the pin plate are selectively actuated to cause selected die(s) to be released. An actuator plate having a plurality of actuators can be moved across the pin plate, with actuator(s) selectively actuating corresponding pin(s).
143 Citations
20 Claims
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1. A method for transferring a plurality of integrated circuit dies from a die plate to a substrate, comprising:
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(a) receiving a die plate that has a first surface having a die attached thereto, wherein the die covers a corresponding hole through the die plate;
(b) positioning a transparent planar body against a second surface of the die plate;
(c) positioning the first surface of the die plate and the substrate to be adjacent to each other such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and
(d) applying a stimulus through the transparent planar body to a material filling the hole in the die plate to cause the die to be released from the die plate to come into contact with the contact area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system for transferring integrated circuit dies, comprising:
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a die plate holder configured to mount a die plate, said die plate having a first surface having a die attached thereto, wherein the die covers a corresponding hole through the die plate;
a transparent planar body configured to be positioned against a second surface of the die plate;
a substrate supply configured to present a substrate, wherein the die plate holder is further configured to position the first surface of the die plate adjacent to the substrate such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and
a stimulus source configured to apply a stimulus through the transparent planar body to a material filling the hole in the die plate to cause the die to be released from the die plate to come into contact with the contact area. - View Dependent Claims (10, 11)
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12. A method of transferring a plurality of integrated circuit dies from a die plate to a substrate, comprising:
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(a) receiving a die plate that has a first surface having a die attached thereto, wherein the die covers a corresponding hole in the die plate;
(b) aligning a pin with the hole in the die plate;
(c) positioning the first surface of the die plate and the substrate to be adjacent to each other such that the die is closely adjacent to a corresponding contact area on a first surface of the substrate; and
(d) selectively actuating the pin to cause the die to be released from the die plate to come into contact with the contact area. - View Dependent Claims (13, 14, 15)
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16. A system to transfer integrated circuit dies, comprising:
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a die plate holder to mount a die plate, said die plate having a first surface having a die attached thereto, wherein the die covers a corresponding hole in the die plate;
a pin plate holder to align a pin of a pin plate with the hole in the die plate;
a substrate supply to present a substrate; and
an actuator to selectively actuate the pin to cause the die to be released from the die plate to come into contact with a contact area on a first surface of the substrate. - View Dependent Claims (17, 18, 19, 20)
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Specification