Power lamp package
First Claim
1. A semiconductor device die package comprising:
- a substrate having a first surface for supporting a semiconductor device, and one or more substrate holes in said substrate at said first surface, and a reflector cup comprising at least one or more posts, each of which cooperates with a respective one of said substrate holes to anchor said reflector cup to said substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
Adhesive-free assembly of the substrate and reflector components of a semiconductor die package is achieved by injection molding the reflector onto a surface of the substrate or by molding the reflector separate from the substrate and securing it in place on the substrate through deformation of a portion of the reflector. The reflector may be made reflective either by molding the reflector using a light scattering material or through the addition of a reflective element, such as a piece of foil material that is secured to the reflector. A variety of interchangeable reflective elements having different surface shapes, and thus different light reflecting properties, may be made.
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Citations
38 Claims
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1. A semiconductor device die package comprising:
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a substrate having a first surface for supporting a semiconductor device, and one or more substrate holes in said substrate at said first surface, and a reflector cup comprising at least one or more posts, each of which cooperates with a respective one of said substrate holes to anchor said reflector cup to said substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method of forming a semiconductor die package comprising:
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providing a substrate having a first surface for supporting a semiconductor device;
forming one or more substrate holes in the said substrate, at said first surface;
providing a reflector cup with one or more mounting posts;
anchoring said reflector cup on said first surface by each of said mounting posts cooperating with a respective one of said substrate holes; and
mounting a semiconductor device to said substrate in said reflector cup. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30)
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31. A light emitting diode (LED) die package comprising:
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a substrate having first surface with a mounting pad and one or more first mounting devices;
an LED mounted on said mounting pad;
a reflector cup having a cavity, said reflector cup having one or more second mounting devices, said reflector cup anchored to said substrate by said first mounting devices cooperating with said second mounting devices, said LED arranged within said reflector cup cavity; and
a reflective element associated with said reflector cup to reflect light from said LED. - View Dependent Claims (32, 33)
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34. A light emitting diode (LED) die package comprising:
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a substrate having first and second surfaces and a mounting pad on the first surface;
a base secured to the first surface, the base having an inner surface substantially surrounding the mounting pad;
a reflective element associated with the inner surface; and
an LED assembly mounted on the mounting pad. - View Dependent Claims (35, 36, 37, 38)
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Specification