Method of interconnecting terminals and method for mounting semiconductor device
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Accused Products
Abstract
A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.
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Citations
12 Claims
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1-7. -7. (canceled)
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8. A method of interconnecting terminals comprising:
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placing terminals so as to oppose each other with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing terminals;
heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completed cured, wherein in the heating, the electrically conductive particles collect between the opposing terminals by melting and agglomeration of the electrically conductive particles, and the opposing terminals are electrically interconnected; and
curing the resin component. - View Dependent Claims (9, 10)
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11. A method of mounting a semiconductor device comprising:
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placing electrode pads of a semiconductor chip opposite circuit electrodes provided on a circuit substrate so as to correspond to the electrode pads with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing electrode pads and circuit electrodes;
heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completed cured, wherein in the heating, the electrically conductive particles collect between the opposing electrode pads and circuit electrodes by melting and agglomeration of the electrically conductive particles, and the opposing electrode pads and circuit electrodes are electrically interconnected; and
curing the resin component. - View Dependent Claims (12)
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Specification