Method of interconnecting terminals and method for mounting semiconductor device

• US 20070001313A1
• Filed: 02/04/2004
• Published: 01/04/2007
• Est. Priority Date: 02/05/2003
• Status: Active Grant

• Current Assignee: Kozo Fujimoto, Senju Metal Industry Company Limited
• Original Assignee: Kozo Fujimoto, Senju Metal Industry Company Limited
• Inventors: Fujimoto, Kozo, Kim, Jong-Min, Yasuda, Kiyokazu
• Granted Patent: US 7,524,748 B2
• Time in Patent Office: Days
• US Class Current: 257/778
• CPC Class Codes: H01L 2224/0554 External layer
• CPC Class Codes: H01L 2224/0555 Shape
• CPC Class Codes: H01L 2224/0556 Disposition
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/1329 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/133 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/29109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/29111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/29305 Gallium [Ga] as principal constituent
• CPC Class Codes: H01L 2224/29309 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/29311 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/29313 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/29314 Thallium [Tl] as principal constituent
• CPC Class Codes: H01L 2224/29316 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/29318 : Zinc [Zn] as principal constituent
• CPC Class Codes: H01L 2224/29339 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29347 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/818 : Bonding techniques
• CPC Class Codes: H01L 2224/83136 : involving guiding structures, e.g. spacers or supporting members
• CPC Class Codes: H01L 2224/8319 : Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/83886 : Involving a self-assembly process, e.g. self-agglomeration of a material dispersed in a fluid
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01038 : Strontium [Sr]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01064 : Gadolinium [Gd]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01083 : Bismuth [Bi]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/0133 : Ternary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/0781 : being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/12041 : LED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/157 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H05K 2201/10674 : Flip chip
• CPC Class Codes: H05K 2203/0425 : Solder powder or solder coated metal powder
• CPC Class Codes: H05K 3/321 : by conductive adhesives

Abstract

A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconductor chip 20 and lands 11 which are provided on a substrate 10 so as to correspond with the electrode pads 21 are placed so as to oppose each other with an electrically conductive adhesive therebetween. Then, the electrically conductive adhesive is heated to a temperature which is higher than the melting point of electrically conductive particles contained in the electrically conductive adhesive and at which a resin is not completely cured, and the electrically conductive particles are bonded to each other. Then, the semiconductor chip 20 and the substrate 10 are secured by completely curing the resin in the electrically conductive adhesive.

Claims

1-7. -7. (canceled)

8. A method of interconnecting terminals comprising:

placing terminals so as to oppose each other with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing terminals;

heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completed cured, wherein in the heating, the electrically conductive particles collect between the opposing terminals by melting and agglomeration of the electrically conductive particles, and the opposing terminals are electrically interconnected; and

curing the resin component.

9. A method of interconnecting terminals as claimed in claim 8 wherein the resin component comprises a resin having reducing properties which can reduce at least one of the surface of the terminals and the surface of the electrically conductive particles.

10. A method of interconnecting terminals as claimed in claim 8 including completely filling the space between members on which the terminals are provided with the resin composition.

11. A method of mounting a semiconductor device comprising:

placing electrode pads of a semiconductor chip opposite circuit electrodes provided on a circuit substrate so as to correspond to the electrode pads with an anisotropic electrically conductive resin composition including at least electrically conductive particles and a resin component which is not completely cured at the melting point of the electrically conductive particles disposed between the opposing electrode pads and circuit electrodes;

heating the resin composition to a temperature which is higher than the melting point of the electrically conductive particles and at which the resin component is not completed cured, wherein in the heating, the electrically conductive particles collect between the opposing electrode pads and circuit electrodes by melting and agglomeration of the electrically conductive particles, and the opposing electrode pads and circuit electrodes are electrically interconnected; and

curing the resin component.

12. A mounting method as claimed in claim 11 ding completely filling the space between the semiconductor and the circuit substrate with the resin composition.