Light-emitting device
First Claim
1. A light-emitting device comprising:
- a submount comprising a mount base, at least one light-emitting diode chip mounted thereon and electrically conducting lines formed on the mount base to be connected electrically to the light-emitting diode chip; and
a first plate for heat transfer comprising a metallic plate;
wherein a first plane of the mount base opposed to the metallic plate of the first plate is bonded thermally to said first plate.
2 Assignments
0 Petitions
Accused Products
Abstract
A light-emitting device (200) has a submount (100) and a plate for heat transfer (300) having a metallic plate (30). The submount (100) has a mount base (10), at least one light-emitting diode chip (5) mounted thereon and electrically conducting lines (12-17) formed on the mount base (10) to be connected electrically to the light-emitting diode chip (5). A first plane (11) of the mount base (10) of the submount (100) is bonded thermally to the first plate (300). For example, the plate is a circuit board having a metallic plate (30), and the submount (100) is bonded thermally to the metallic plate (30) of the one of the at least one plate (300). In an example, a second plate for heat transfer is also bonded thermally to a second plane of the mount base (100) for providing a plurality of heat transfer paths.
103 Citations
28 Claims
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1. A light-emitting device comprising:
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a submount comprising a mount base, at least one light-emitting diode chip mounted thereon and electrically conducting lines formed on the mount base to be connected electrically to the light-emitting diode chip; and
a first plate for heat transfer comprising a metallic plate;
wherein a first plane of the mount base opposed to the metallic plate of the first plate is bonded thermally to said first plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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Specification