Electronics assembly and electronics package carrier therefor
First Claim
1. An electronics assembly comprising:
- a substrate;
at least one electronics package connected to the substrate, said electronics package comprising electrical circuitry and first and second sides;
a heat sink device positioned in thermal communication with the first side surface of the electronics package; and
a carrier disposed between the substrate and the heat sink device, said carrier comprising a resilient wall for biasing the electronics package towards the heat sink device such that a controlled bond line is provided between the first side of the electronics package and the heat sink device.
2 Assignments
0 Petitions
Accused Products
Abstract
An electronics assembly is provided having a carrier that provides a controlled height variability between electronics packages and a heat sink device. The electronics assembly includes a substrate and electronics packages connected to the substrate. The assembly also includes a heat sink device positioned in thermal communication with a first side of the electronics packages. The assembly further includes a carrier disposed between the substrate and the heat sink device. The carrier has a resilient wall that biases the electronics packages towards the heat sink device such that a controlled bond line is provided between the first side of the electronics packages and the heat sink device.
-
Citations
20 Claims
-
1. An electronics assembly comprising:
-
a substrate;
at least one electronics package connected to the substrate, said electronics package comprising electrical circuitry and first and second sides;
a heat sink device positioned in thermal communication with the first side surface of the electronics package; and
a carrier disposed between the substrate and the heat sink device, said carrier comprising a resilient wall for biasing the electronics package towards the heat sink device such that a controlled bond line is provided between the first side of the electronics package and the heat sink device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
-
-
13. An electronics package carrier for use in an electronics assembly, said carrier comprising:
-
a frame generally defining at least one area for receiving an electronics package, wherein the electronics package connects to a substrate on a first side and is in thermal communication with a heat sink device on the opposite second side;
a resilient wall formed at the at least one area for biasing the electronics package towards a heat sink device; and
connecting members adapted to engage a member of the electronics assembly to hold the electronics package in a desired orientation relative to the heat sink device such as to provide a controlled bond line. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
-
Specification