Programmed material consolidation methods employing machine vision
First Claim
1. A method for forming three-dimensional structures comprising:
- providing a support element;
electronically viewing at least a portion of the support element to locate an identified area on or over the support element; and
selectively dispensing unconsolidated material toward the identified area.
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Accused Products
Abstract
Programmed material consolidation methods include the use of electronic viewing or machine vision. A feature or location of a support or substrate is recognized or identified and material dispersed relative to the recognized or identified feature or location. The material may be selectively dispensed and at least partially consolidated either actively or passively. By use of the machine vision system, the precise location on a substrate or support element may be determined and communicated to the dispense element of programmed material consolidation system such that a flowable material may be deposited and consolidated at a desired location to form a structural feature.
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Citations
31 Claims
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1. A method for forming three-dimensional structures comprising:
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providing a support element;
electronically viewing at least a portion of the support element to locate an identified area on or over the support element; and
selectively dispensing unconsolidated material toward the identified area. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for forming a mask element comprising:
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providing a substrate;
selectively dispensing unconsolidated sacrificial material onto at least one predetermined location of the substrate;
at least partially consolidating the unconsolidated sacrificial material;
applying unconsolidated material to the substrate and the at least one mask element;
at least partially consolidating the unconsolidated material; and
removing the sacrificial material. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A method of packaging a semiconductor device, comprising:
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providing at least one semiconductor die having a back surface and an active surface including at least one array of optically interactive elements thereon;
locating a peripheral region of the at least one array of optically interactive elements; and
selectively dispensing two or more adjacent, mutually adhered regions of consolidatable material to form a support structure that substantially surrounds the at least one array. - View Dependent Claims (26, 27, 28, 29, 30, 31)
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Specification