Method of manufacturing light emitting diode package

• US 20070196939A1
• Filed: 02/22/2007
• Published: 08/23/2007
• Est. Priority Date: 02/22/2006
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electro-Mechanics Co., Ltd. (Samsung Group)
• Inventors: Park, Youn Gon, Lee, Jong Myeon, Choo, Ho Sung, Chang, Myung Whun, Lee, Hai Sung
• Granted Patent: US 8,557,617 B2
• Time in Patent Office: Days
• US Class Current: 438/22
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape

Abstract

A method of manufacturing a light emitting diode package. A cup-shaped package structure with a recess formed therein and an electrode structure formed on a bottom of the recess is prepared. A light emitting diode chip is mounted on a bottom of the recess with a terminal of the chip electrically connected to the electrode structure. A liquid-state transparent resin is injected in the recess and before the liquid-state transparent resin is completely cured, a stamp with a micro rough pattern engraved thereon is applied on an upper surface of the resin. The liquid-state transparent resin is cured with the stamp applied thereon to form a resin encapsulant and the stamp is removed from the resin encapsulant.

Claims

1. A method of manufacturing a light emitting diode package comprising:

preparing a cup-shaped package structure with a recess formed in an upper surface thereof and an electrode structure formed on a bottom of the recess;

mounting a light emitting diode chip on a bottom of the recess with a terminal of the light emitting diode chip electrically connected to the electrode structure;

injecting a liquid-state transparent resin in the recess of the package structure;

applying a stamp with a micro rough pattern engraved thereon, on an upper surface of the liquid-state transparent resin before the liquid-state transparent resin is completely cured;

curing the liquid-state transparent resin with the stamp applied thereon to form a resin encapsulant; and

removing the stamp from the resin encapsulant.

2. The method according to claim 1, wherein the step of applying a stamp is implemented after the injected liquid-state transparent resin is partially cured.

3. The method according to claim 1, wherein the step of injecting a liquid-state transparent resin comprises injecting the liquid-state transparent resin in such an amount that the upper surface of the injected liquid-state transparent resin is higher than the upper end of the recess of the package structure.

4. The method according to claim 1, wherein the liquid-state transparent resin has phosphor dispersed therein to convert the wavelength.

5. The method according to claim 1, further comprising forming a phosphor film for converting the wavelength on a surface of the light emitting diode chip before forming a resin encapsulant.

6. The method according to claim 1, wherein the step of forming a resin encapsulant comprises a deaeration process to remove bubbles in the liquid-state transparent resin with the stamp applied on the liquid-state transparent resin.

7. The method according to claim 1, wherein the stamp comprises a planar structure with the micro rough pattern engraved on a surface thereof.

8. The method according to claim 1, wherein the micro rough pattern engraved on the stamp comprises a plurality of triangular prisms arranged in one direction.

9. The method according to claim 1, wherein the rough pattern engraved on the stamp comprises a plurality of quadrangular pyramids arranged in lines and rows.

10. The method according to claim 1, further comprising applying a release agent on a surface of the stamp that comes in contact with the transparent resin before applying the stamp.