Methods for producing MEMS with protective coatings using multi-component sacrificial layers
First Claim
1. A method of manufacturing a microelectromechanical device, the method comprising:
- forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and
selectively removing the sacrificial material from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material.
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Abstract
Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.
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Citations
39 Claims
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1. A method of manufacturing a microelectromechanical device, the method comprising:
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forming a composite layer on a surface of a microelectromechanical device, the composite layer comprising a mixture of a sacrificial material and a protective material; and
selectively removing the sacrificial material from the composite layer, thereby forming a protective coating on one or more surfaces of the microelectromechanical device, the protective coating comprising the protective material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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24. A microelectromechanical device comprising:
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a substrate;
a mirror positioned over the substrate, the mirror being at least partially reflective to incident light;
an optical layer positioned over the substrate and spaced from the mirror, the optical layer being at least partially transmissive to incident light; and
a protective coating, wherein the optical layer and the mirror define a cavity and the protective coating overlies surfaces of the microelectromechanical device exposed to the cavity. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31)
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32. A microelectromechanical device comprising:
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a substrate;
a mirror positioned over the substrate, the mirror being at least partially reflective to incident light;
an optical layer positioned over the substrate and spaced from the mirror, the optical layer being at least partially transmissive to incident light; and
a composite layer comprising a mixture of a sacrificial material and a protective material, the composite layer being between the mirror and the optical layer. - View Dependent Claims (33, 34, 35, 36, 37, 38)
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39. A microelectromechanical device comprising:
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means for reflecting light, the means for reflecting light being at least partially reflective to incident light;
means for supporting the means for reflecting light wherein the means for reflecting light is positioned over the means for supporting;
means for transmitting light, the means for transmitting light being positioned over the substrate and spaced from the means for reflecting light, and at least partially transmissive to incident light; and
means for protecting the microelectromechanical device, the means for protecting the microelectromechanical device being between the mirror and the optical layer and comprising a mixture of a sacrificial material and a protective material.
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Specification