MEMS Device Wafer-Level Package
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Abstract
A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a part of the wafer.
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Citations
29 Claims
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1-21. -21. (canceled)
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22. A wafer structure for manufacturing semiconductor devices, the wafer structure comprising:
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a) a semiconductor wafer comprising a plurality of dies;
b) an adhesive bead affixed to at least one of the plurality of dies;
b) a window mounted to the least one die by the adhesive bead, wherein at least one of the plurality of dies does not have a window mounted to it. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29)
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Specification