Method and apparatus for automatically detecting and correcting misalignment of a semiconductor chip

• US 20070266557A1
• Filed: 05/19/2006
• Published: 11/22/2007
• Est. Priority Date: 05/19/2006
• Status: Active Grant

• Current Assignee: Oracle America, Inc. (Oracle Corporation)
• Original Assignee: Oracle America, Inc. (Oracle Corporation)
• Inventors: Drost, Robert J., Douglas, David C., Ho, Ronald
• Granted Patent: US 7,949,436 B2
• Time in Patent Office: Days
• US Class Current: 29/834
• CPC Class Codes: G02B 6/4226 Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
• CPC Class Codes: H01L 22/12 for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions electrical measurement of diffusions H01L22/14
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06531 Non-galvanic coupling, e.g. capacitive coupling
• CPC Class Codes: H01L 2225/06534 Optical coupling
• CPC Class Codes: H01L 2225/06593 Mounting aids permanently on device; arrangements for alignment use of temporary supports H01L21/6835
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19042 being an inductor
• CPC Class Codes: H01L 2924/30105 Capacitance
• CPC Class Codes: H01L 2924/30107 Inductance
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 2201/10083 Electromechanical or electro-acoustic component, e.g. microphone
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 2201/10674 Flip chip
• CPC Class Codes: H05K 2203/166 Alignment or registration; Control of registration
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49133 : with component orienting

Abstract

One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.

Claims

1. A method for automatically detecting and correcting a misalignment of a semiconductor chip, comprising:

using a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip; and

using an actuation mechanism integrated with the chip to automatically correct the misalignment.

2. The method of claim 1, wherein the position-detection mechanism includes a position-detection sensor integrated with the chip, wherein the position-detection sensor includes:

an optical sensor;

a capacitive sensor;

an inductive sensor;

or

a conductive sensor.

3. The method of claim 1, wherein the actuation mechanism includes:

a piezo-electric actuator;

an electro-static actuator;

an electro-thermal actuator;

or

an inductive actuator.

4. The method of claim 1, wherein the desired alignment of the chip is with respect to a second chip to facilitate interactions between the chip and the second chip.

5. The method of claim 1, wherein the method is performed with closed-loop control, wherein the misalignment is automatically determined by the integrated sensor, and the integrated actuator automatically corrects the misalignment.

6. The method of claim 1, wherein correcting the misalignment additionally involves removing the chip from operation if the determined misalignment indicates a possible system failure.

7. The method of claim 1, wherein the method is applied to a set of chips, such that the method automatically detects and corrects the misalignment of each chip with respect to neighboring chips in the set of chips during either assembly or operation of a system which includes the set of chips.

8. The method of claim 1, wherein the misalignment of the chip may be caused by:

movement of the chip;

thermal expansion or contraction of the chip or a chip assembly;

or

vibration of an assembly to which the chip is affixed.

9. A computer-readable storage medium storing instructions that when executed by a computer cause the computer to perform a method for automatically detecting and correcting a misalignment of a semiconductor chip, comprising:

using signals received from a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip; and

sending signals to an actuation mechanism integrated with the chip to automatically correct the misalignment.

10. The computer-readable storage medium of claim 9, wherein the position-detection mechanism includes a position-detection sensor integrated with the chip, wherein the position-detection sensor includes:

an optical sensor;

a capacitive sensor;

an inductive sensor;

or

a conductive sensor.

11. The computer-readable storage medium of claim 9, wherein the actuation mechanism includes:

a piezo-electric actuator;

an electro-static actuator;

an electro-thermal actuator;

or

an inductive actuator.

12. The computer-readable storage medium of claim 9, wherein the desired alignment of the chip is with respect to a second chip to facilitate interactions between the chip and the second chip.

13. The computer-readable storage medium of claim 9, wherein the method is performed with closed-loop control, wherein the misalignment is automatically determined by the integrated sensor, and the integrated actuator automatically corrects the misalignment.

14. The computer-readable storage medium of claim 9, wherein correcting the misalignment additionally involves programmatically removing the chip from operation if the determined misalignment indicates a possible system failure.

15. The computer-readable storage medium of claim 9, wherein the method is applied to a set of chips, such that the method automatically detects and corrects the misalignment of each chip with respect to neighboring chips in the set of chips either during assembly or operation of a system which includes the set of chips.

16. The computer-readable storage medium of claim 9, wherein the misalignment of the semiconductor chip may be caused by:

movement of the chip;

thermal expansion or contraction of the chip or a chip assembly;

or

vibration of an assembly to which the chip is affixed.

17. An apparatus for automatically detecting and correcting a misalignment of a semiconductor chip, comprising:

a position-detection mechanism integrated with the chip and configured to determine the misalignment of the chip from a desired alignment for the chip; and

an actuation mechanism integrated with the chip and configured to automatically correct the misalignment.

18. The apparatus of claim 17, wherein the position-detection mechanism includes a position-detection sensor integrated with the chip, wherein the position-detection sensor includes:

an optical sensor;

a capacitive sensor;

an inductive sensor;

or

a conductive sensor.

19. The apparatus of claim 17, wherein the actuation mechanism includes:

a piezo-electric actuator;

an electro-static actuator;

an electro-thermal actuator;

or

an inductive actuator.

20. The apparatus of claim 17, wherein the desired alignment of the chip is with respect to a second chip to facilitate interactions between the chip and the second chip.

21. The apparatus of claim 17, wherein the position-detection mechanism and the actuation mechanism are arranged to form a closed-loop control, wherein the misalignment is automatically determined by the integrated sensor, and the integrated actuator automatically corrects the misalignment.