Transparent Conductive Laminated Body And Transparent Touch Panel
First Claim
1. A transparent conductive laminated body having a cured resin layer-1 and cured resin layer-2 laminated in that order on at least one side of a transparent organic polymer base, and a transparent conductive layer laminated on the cured resin layer-2, the transparent conductive laminated body being characterized in that the relationship between the film thickness d1 of the cured resin layer-1 and the film thickness d2 of the cured resin layer-2 is 0.1≦
- d2/d1≦
3.0, the thickness of each is 0.5 μ
m≦
d1>
10 μ
m, 0.5 μ
m≦
d2≦
10 μ
m, and at least one of the following conditions (A) to (C) are satisfied. Condition (A);
The Young'"'"'s moduli of the cured resin layer-1 and the cured resin layer-2 are different and satisfy the relationships W2>
W0>
W1 and W2>
W3>
W1 as measured by an indentation hardness test (indentation tester/set indentation depth;
0.5 μ
m), and the Young'"'"'s modulus W3 is in the range of 1.9 GPa≦
W3≦
8.8 GPa (200 kgf/mm2≦
W3≦
900 kgf/mm2). (Wherein the Young'"'"'s modulus of the transparent organic polymer base is represented as W0, the Young'"'"'s modulus measured upon forming the cured resin layer-1 on the transparent organic polymer base is represented as W1, the Young'"'"'s modulus upon forming the cured resin layer-2 on the transparent organic polymer base is represented as W2, and the Young'"'"'s modulus upon laminating the cured resin layer-1 and cured resin layer-2 in that order on the transparent organic polymer base is represented as W3.) Condition (B);
The plastic deformation hardness differs for the cured resin layer-1 and cured resin layer-2, and are in the relationships HV2>
HV0>
HV1 and HV2>
HV3>
HV1. (Wherein the plastic deformation hardness of the transparent organic polymer base is represented by HV0, the plastic deformation hardness measured when the cured resin layer-1 is formed on the transparent organic polymer base is represented as HV1, the plastic deformation hardness measured when the cured resin layer-2 is formed on the transparent organic polymer base is represented as HV2, and the plastic deformation hardness when the cured resin layer-1 and cured resin layer-2 are laminated in that order on the transparent organic polymer base is represented as HV3.) Condition (C);
The hardnesses of the cured resin layer-1 and cured resin layer-2 differ, the relationships DH2>
DH0>
DH1 and DH2>
DH3>
DH1 are satisfied as measured with an indentation hardness tester (nanoindentation tester/set indentation depth;
0.5 μ
m), and the hardness DH3 is in the range of 98 MPa≦
DH3≦
392 MPa (10 kgf/mm2≦
DH3≦
40 kgf/mm2). (Wherein the hardness of the transparent organic polymer base is represented as DH0, the hardness measured upon forming the cured resin layer-1 on the transparent organic polymer base is represented as DH1, the hardness measured upon forming the cured resin layer-2 on the transparent-organic polymer base is represented as DH2 and the hardness upon laminating the cured resin layer-1 and cured resin layer-2 in that order on the transparent organic polymer base is represented as DH3.)
1 Assignment
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Accused Products
Abstract
A transparent conductive laminated body having a cured resin layer-1 and cured resin layer-2 laminated in that order on at least one side of a transparent organic polymer base, with a transparent conductive layer laminated on the cured resin layer-2, wherein at least one relationship among the following: (A) the relationship between the Young'"'"'s moduli of the cured resin layer-1 and the cured resin layer-2, (B) the relationship between the plastic deformation hardnesses of the cured resin layer-1 and the cured resin layer-2 and (C) the relationship between the hardnesses of the cured resin layer-1 and the cured resin layer-2, is in a specified range, as well as a transparent touch panel employing the transparent conductive laminated body.
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Citations
26 Claims
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1. A transparent conductive laminated body having a cured resin layer-1 and cured resin layer-2 laminated in that order on at least one side of a transparent organic polymer base, and a transparent conductive layer laminated on the cured resin layer-2, the transparent conductive laminated body being characterized in that the relationship between the film thickness d1 of the cured resin layer-1 and the film thickness d2 of the cured resin layer-2 is 0.1≦
- d2/d1≦
3.0, the thickness of each is 0.5 μ
m≦
d1>
10 μ
m, 0.5 μ
m≦
d2≦
10 μ
m, and at least one of the following conditions (A) to (C) are satisfied.Condition (A);
The Young'"'"'s moduli of the cured resin layer-1 and the cured resin layer-2 are different and satisfy the relationships W2>
W0>
W1 and W2>
W3>
W1 as measured by an indentation hardness test (indentation tester/set indentation depth;
0.5 μ
m), and the Young'"'"'s modulus W3 is in the range of 1.9 GPa≦
W3≦
8.8 GPa (200 kgf/mm2≦
W3≦
900 kgf/mm2). (Wherein the Young'"'"'s modulus of the transparent organic polymer base is represented as W0, the Young'"'"'s modulus measured upon forming the cured resin layer-1 on the transparent organic polymer base is represented as W1, the Young'"'"'s modulus upon forming the cured resin layer-2 on the transparent organic polymer base is represented as W2, and the Young'"'"'s modulus upon laminating the cured resin layer-1 and cured resin layer-2 in that order on the transparent organic polymer base is represented as W3.)Condition (B);
The plastic deformation hardness differs for the cured resin layer-1 and cured resin layer-2, and are in the relationships HV2>
HV0>
HV1 and HV2>
HV3>
HV1. (Wherein the plastic deformation hardness of the transparent organic polymer base is represented by HV0, the plastic deformation hardness measured when the cured resin layer-1 is formed on the transparent organic polymer base is represented as HV1, the plastic deformation hardness measured when the cured resin layer-2 is formed on the transparent organic polymer base is represented as HV2, and the plastic deformation hardness when the cured resin layer-1 and cured resin layer-2 are laminated in that order on the transparent organic polymer base is represented as HV3.)Condition (C);
The hardnesses of the cured resin layer-1 and cured resin layer-2 differ, the relationships DH2>
DH0>
DH1 and DH2>
DH3>
DH1 are satisfied as measured with an indentation hardness tester (nanoindentation tester/set indentation depth;
0.5 μ
m), and the hardness DH3 is in the range of 98 MPa≦
DH3≦
392 MPa (10 kgf/mm2≦
DH3≦
40 kgf/mm2). (Wherein the hardness of the transparent organic polymer base is represented as DH0, the hardness measured upon forming the cured resin layer-1 on the transparent organic polymer base is represented as DH1, the hardness measured upon forming the cured resin layer-2 on the transparent-organic polymer base is represented as DH2 and the hardness upon laminating the cured resin layer-1 and cured resin layer-2 in that order on the transparent organic polymer base is represented as DH3.) - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
- d2/d1≦
Specification