Transparent Conductive Laminated Body And Transparent Touch Panel

• US 20070298231A1
• Filed: 12/27/2004
• Published: 12/27/2007
• Est. Priority Date: 09/07/2004
• Status: Abandoned Application

• Current Assignee: Teijin Limited
• Original Assignee: Teijin Limited
• Inventors: Ito, Haruhiko, Mikoshiba, Hitoshi, Shiroishi, Isao
• Application Number:
  US11/661,759
• Publication Number:
  US 20070298231A1
• Time in Patent Office: Days
• US Class Current: 428/213
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B32B 2307/202 Conductive
• CPC Class Codes: B32B 2307/412 Transparent
• CPC Class Codes: B32B 2307/418 Refractive
• CPC Class Codes: B32B 2307/704 Crystalline
• CPC Class Codes: B32B 2457/208 Touch screens
• CPC Class Codes: B32B 27/00 Layered products comprising a layer of synthetic resin fibrous or filamentary layer made of a synthetic resin B32B5/02; particulate layer made of a synthetic resin B32B5/16; foamed layer made of a synthetic resin B32B5/18
• CPC Class Codes: B32B 27/08 of synthetic resin
• CPC Class Codes: B32B 27/18 characterised by the use of special additives
• CPC Class Codes: Y10T 428/2495 Thickness [relative or absolute]
• CPC Class Codes: Y10T 428/24983 Hardness

Abstract

A transparent conductive laminated body having a cured resin layer-1 and cured resin layer-2 laminated in that order on at least one side of a transparent organic polymer base, with a transparent conductive layer laminated on the cured resin layer-2, wherein at least one relationship among the following: (A) the relationship between the Young'"'"'s moduli of the cured resin layer-1 and the cured resin layer-2, (B) the relationship between the plastic deformation hardnesses of the cured resin layer-1 and the cured resin layer-2 and (C) the relationship between the hardnesses of the cured resin layer-1 and the cured resin layer-2, is in a specified range, as well as a transparent touch panel employing the transparent conductive laminated body.

Claims

1. A transparent conductive laminated body having a cured resin layer-1 and cured resin layer-2 laminated in that order on at least one side of a transparent organic polymer base, and a transparent conductive layer laminated on the cured resin layer-2, the transparent conductive laminated body being characterized in that the relationship between the film thickness d₁ of the cured resin layer-1 and the film thickness d₂ of the cured resin layer-2 is 0.1≦

d₂/d₁≦

3.0, the thickness of each is 0.5 μ

m≦

d₁>

10 μ

m, 0.5 μ

m≦

d₂≦

10 μ

m, and at least one of the following conditions (A) to (C) are satisfied.

Condition (A);

The Young'"'"'s moduli of the cured resin layer-1 and the cured resin layer-2 are different and satisfy the relationships W₂>

W₀>

W₁ and W₂>

W₃>

W₁ as measured by an indentation hardness test (indentation tester/set indentation depth;

0.5 μ

m), and the Young'"'"'s modulus W₃ is in the range of 1.9 GPa≦

W₃≦

8.8 GPa (200 kgf/mm²≦

W₃≦

900 kgf/mm²). (Wherein the Young'"'"'s modulus of the transparent organic polymer base is represented as W₀, the Young'"'"'s modulus measured upon forming the cured resin layer-1 on the transparent organic polymer base is represented as W₁, the Young'"'"'s modulus upon forming the cured resin layer-2 on the transparent organic polymer base is represented as W₂, and the Young'"'"'s modulus upon laminating the cured resin layer-1 and cured resin layer-2 in that order on the transparent organic polymer base is represented as W₃.)

Condition (B);

The plastic deformation hardness differs for the cured resin layer-1 and cured resin layer-2, and are in the relationships HV₂>

HV₀>

HV₁ and HV₂>

HV₃>

HV₁. (Wherein the plastic deformation hardness of the transparent organic polymer base is represented by HV₀, the plastic deformation hardness measured when the cured resin layer-1 is formed on the transparent organic polymer base is represented as HV₁, the plastic deformation hardness measured when the cured resin layer-2 is formed on the transparent organic polymer base is represented as HV₂, and the plastic deformation hardness when the cured resin layer-1 and cured resin layer-2 are laminated in that order on the transparent organic polymer base is represented as HV₃.)

Condition (C);

The hardnesses of the cured resin layer-1 and cured resin layer-2 differ, the relationships DH₂>

DH₀>

DH₁ and DH₂>

DH₃>

DH₁ are satisfied as measured with an indentation hardness tester (nanoindentation tester/set indentation depth;

0.5 μ

m), and the hardness DH₃ is in the range of 98 MPa≦

DH₃≦

392 MPa (10 kgf/mm²≦

DH₃≦

40 kgf/mm²). (Wherein the hardness of the transparent organic polymer base is represented as DH₀, the hardness measured upon forming the cured resin layer-1 on the transparent organic polymer base is represented as DH₁, the hardness measured upon forming the cured resin layer-2 on the transparent-organic polymer base is represented as DH₂ and the hardness upon laminating the cured resin layer-1 and cured resin layer-2 in that order on the transparent organic polymer base is represented as DH₃.)

2. A transparent conductive laminated body according to claim 1, wherein the film thickness d₁ of the cured resin layer-1 and the film thickness d₂ of the cured resin layer-2 are in the relationship 0.15≦

d₂/d₁≦

2.5, and the layer thicknesses are 1 μ

m≦

d₁≦

10 μ

m, 1 μ

m≦

d₂≦

10 μ

m.

3. A transparent conductive laminated body according to claim 1, wherein condition (A′

) below is also satisfied.

Condition (A′

);

The Young'"'"'s modulus W₃ is in the range of 3.9 GPa≦

W₃≦

8.8 GPa (400 kgf/mm²≦

W₃≦

900 kgf/mm²).

4. A transparent conductive laminated body according to claim 1, wherein at least one of the following conditions (D) to (F) is also satisfied.

Condition (D):

The Young'"'"'s modulus W₁ is 0.3 GPa≦

W₁≦

4.9 GPa (30 kgf/mm²≦

W₁≦

500 kgf/mm²), and the Young'"'"'s modulus W₂ is 6.9 GPa≦

W₂≦

9.8 GPa (700 kgf/mm²≦

W₂≦

1000 kgf/mm²).

Condition (E);

The plastic deformation hardness HV₁ is 9.8 MPa≦

HV₁≦

196 MPa (1 kgf/mm²≦

HV₁≦

20 kgf/mm²), and the plastic deformation hardness HV₂ is 588 MPa≦

HV₂≦

1078 MPa (60 kgf/mm²≦

HV₂≦

110 kgf/mm²).

Condition (F);

The hardness DH₁ is 9.8 MPa≦

DH₁≦

147 MPa (1 kgf/mm²≦

DH₁≦

15 kgf/mm²), and DH₂ is 245 MPa≦

DH₂≦

490 MPa (25 kgf/mm²≦

DH₂≦

50 kgf/mm²).

5. A transparent conductive laminated body according to claim 4, wherein condition (D′

) below is also satisfied.

Condition (D′

);

The Young'"'"'s modulus W₁ is 0.5 GPa≦

W₁≦

4.9 GPa (50 kgf/mm²≦

W₁≦

500 kgf/mm²), and the Young'"'"'s modulus W₂ is 6.9 GPa≦

W₂≦

9.8 GPa (700 kgf/mm²≦

W₂≦

1000 kgf/mm²).

6. A transparent conductive laminated body according to claim 4, wherein condition (G) below is also satisfied.

Condition (G):

The plastic deformation hardness HV₃ is in the range of 98 MPa≦

HV₃≦

833 MPa (10 kgf/mm²≦

HV₃≦

85 kgf/mm²).

7. A transparent conductive laminated body according to claim 6, wherein condition (G′

) below is also satisfied.

Condition (G′

);

The plastic deformation hardness HV₃ is in the range of 196 MPa≦

HV₃≦

833 MPa (20 kgf/mm²≦

HV₃≦

85 kgf/mm²).

8. A transparent conductive laminated body according to claim 1, which further comprises a metal compound layer situated between the cured resin layer-2 and the transparent conductive layer and in contact with the transparent conductive layer, having a thickness which is smaller than that of the transparent conductive layer and in a range of 0.5 nm to 10.0 nm.

9. A transparent conductive laminated body according to claim 1, wherein the cured resin layer-1 contains at least one component selected from the group consisting of (a) cured resins of urethane acrylate monomer and (b) synthetic rubber materials at 10 wt % or greater.

10. A transparent conductive laminated body according to claim 8, wherein the cured resin layer-1 contains at least one component selected from the group consisting of (a) cured resins of urethane acrylate monomer and (b) synthetic rubber materials at 10 wt % or greater.

11. A transparent conductive laminated body according to claim 1, which comprises a cured resin layer-3 having a refractive index of 1.20-1.55 and a thickness of 0.05-0.5 μ

m between the cured resin layer-2 and the transparent conductive layer.

12. A transparent conductive laminated body according to claim 11, wherein the cured resin layer-3 contains fine particles B having a mean primary particle size of at least 1.1 times the thickness of the cured resin layer-3 and a mean primary particle size of no greater than 1.2 μ

m.

13. A transparent conductive laminated body according to claim 12, wherein the content of the fine particles B in the cured resin layer-3 is no greater than 0.5 wt % based on the cured resin component forming the cured resin layer-3.

14. A transparent conductive laminated body according to claim 8, which comprises a cured resin layer-3 having a refractive index of 1.20-1.55 and a thickness of 0.05-0.5 μ

m between the cured resin layer-2 and the metal compound layer.

15. A transparent conductive laminated body according to claim 14, wherein the cured resin layer-3 contains fine particles B having a mean primary particle size of at least 1.1 times the thickness of the cured resin layer-3 and a mean primary particle size of no greater than 1.2 μ

m.

16. A transparent conductive laminated body according to claim 15, wherein the content of the fine particles B in the cured resin layer-3 is no greater than 0.5 wt % based on the cured resin component forming the cured resin layer-3.

17. A transparent conductive laminated body according to claim 1, which comprises an optical interference layer composed of at least one low-refractive-index layer and at least one high-refractive-index layer between the cured resin layer-2 and the transparent conductive layer, with the low-refractive-index layer in contact with the transparent conductive layer.

18. A transparent conductive laminated body according to claim 17, wherein either or both the high-refractive-index layer and low-refractive-index layer contain fine particles B having a mean primary particle size of at least 1.1 times the thickness of the optical interference layer and a mean primary particle size of no greater than 1.2 μ

m.

19. A transparent conductive laminated body according to claim 18, wherein the content of the fine particles B in the optical interference layer is no greater than 0.5 wt % based on the cured resin component forming the high-refractive-index layer and/or low-refractive-index layer.

20. A transparent conductive laminated body according to claim 8, which comprises an optical interference layer composed of at least one low-refractive-index layer and at least one high-refractive-index layer between the cured resin layer-2 and the metal compound layer, with the low-refractive-index layer in contact with the metal compound layer.

21. A transparent conductive laminated body according to claim 20, wherein either or both the high-refractive-index layer and low-refractive-index layer contain fine particles B having a mean primary particle size of at least 1.1 times the thickness of the optical interference layer and a mean primary particle size of no greater than 1.2 μ

m.

22. A transparent conductive laminated body according to claim 21, wherein the content of the fine particles B in the optical interference layer is no greater than 0.5 wt % based on the cured resin component forming the high-refractive-index layer and/or low-refractive-index layer.

23. A transparent conductive laminated body according to claim 1, wherein the transparent conductive layer is a crystalline film composed mainly of indium oxide, and the thickness of the transparent conductive layer is 5-50 nm.

24. A transparent conductive laminated body according to claim 8, wherein the transparent conductive layer is a crystalline film composed mainly of indium oxide, and the thickness of the transparent conductive layer is 5-50 nm.

25. A transparent touch panel composed of two transparent electrode bases having transparent conductive layers formed on at least one side thereof, situated with the transparent conductive layers facing each other, the transparent touch panel being characterized in that a transparent conductive laminated body according to claim 1 is used as at least one of the transparent electrode bases.

26. A transparent touch panel composed of two transparent electrode bases having transparent conductive layers formed on at least one side thereof, situated with the transparent conductive layers facing each other, the transparent touch panel being characterized in that a transparent conductive laminated body according to claim 8 is used as at least one of the transparent electrode bases.