Wafer Bonding Method
0 Assignments
0 Petitions
Accused Products
Abstract
One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.
13 Citations
32 Claims
-
1-9. -9. (canceled)
-
10. A micro-electronic component, comprising:
-
a substrate including micro-electronic devices thereon; and
a cover including a ring of sealing material secured to said substrate and a raised ring of material positioned opposite said cover from said ring of sealing material. - View Dependent Claims (11, 12, 13, 14, 15, 16)
-
-
17. A micro-electronic component, comprising:
-
a substrate including micro-electronic components positioned thereon;
means for covering said micro-electronic components;
means for sealing said means for covering to said substrate; and
means for localizing a sealing force applied to said means for sealing, said means for localizing positioned opposite said means for covering from and aligned with said means for sealing. - View Dependent Claims (18, 19, 20)
-
-
21. A micro electrical mechanical system, comprising:
-
a substrate including micro electrical devices;
a cover;
a seal ring positioned between and sealing together said cover and said substrate; and
a raised region positioned opposite said cover from said seal ring and being adapted to apply a localized force to said cover only in said raised region. - View Dependent Claims (22, 23)
-
-
24. A method of wafer bonding, comprising:
-
positioning a wafer in a bonding position;
positioning a cover adjacent said wafer;
providing a seal material in a selected region between said wafer and said cover;
providing a raised region of bonding material opposite said cover from said seal material, said bonding material aligned with said seal material; and
applying a bonding force only to said bonding material so as to seal said sealing material to said wafer and to said cover only in said selected region. - View Dependent Claims (25, 26, 27, 28, 29, 30, 31, 32)
-
Specification