Wafer bonding method

• US 8,390,111 B2
• Filed: 10/23/2007
• Issued: 03/05/2013
• Est. Priority Date: 05/10/2005
• Status: Active Grant

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Inventors: Sand, Kirby
• Primary Examiner(s): Im, Junghwa M
• Application Number:
  US11/877,473
• Publication Number:
  US 20080048313A1
• Time in Patent Office: 1,960 Days
• Field of Search: 257/704, 257/619, 257/620, 257/618, 257/E23.193, 257/E21.499, 438/455, 438/456, 438/106
• US Class Current: 257/704
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a raised ring of material positioned opposite the cover from the ring of sealing material.

Claims

1. A micro-electronic component, comprising:

a substrate located on a bonding platen, said substrate including micro-electronic devices thereon; and

a cover including a ring of sealing material secured to said substrate and a raised ring of material located on a surface of said cover, said raised ring of material forming a continuous perimeter on said surface and positioned opposite said cover from said ring of sealing material.

2. The component of claim 1 wherein said raised ring of material is substantially aligned with said ring of sealing material.

3. The component of claim 1 wherein cover is secured to said substrate by said bonding platen, wherein said bonding platen is substantially planar and contacts said cover only at said raised ring of material.

4. The component of claim 3 wherein a force of said bonding platen is applied to said substrate only at said raised ring of material during securing of said ring of sealing material to said substrate.

5. The component of claim 1 wherein said cover is manufactured of glass.

6. The component of claim 1 wherein said micro-electronic components are positioned inwardly of said ring of sealing material and are hermetically sealed by said cover, said substrate, and said ring of sealing material.

7. The component of claim 1 wherein said device is a MEMS device.

8. A micro-electronic component, comprising:

a substrate located on a bonding platen, said substrate including micro-electronic components positioned thereon;

means for covering said micro-electronic components;

means for sealing said means for covering to said substrate; and

means for localizing a sealing force applied to said means for sealing, said means for localizing located on a surface of said means for covering, said means for localizing forming a continuous perimeter on said surface and positioned opposite said means for covering from and aligned with said means for sealing.

9. The component of claim 8 wherein said means for sealing and said means for localizing are initially secured to said means for covering and then said means for covering is secured to said substrate.

10. The component of claim 8 wherein said means for sealing is initially secured to said substrate and said means for localizing is initially secured to said means for covering and thereafter said means for covering is secured to said substrate.

11. The component of claim 8 wherein said means for sealing and said means for localizing each substantially surround a central region of said substrate including said micro-electronic components therein.

12. A micro electrical mechanical system, comprising:

a substrate located on a bonding platen, said substrate including micro electrical devices;

a cover;

a seal ring positioned between and sealing together said cover and said substrate; and

a raised region located on a surface of said cover, said raised region forming a continuous perimeter on said surface and positioned opposite said cover from said seal ring and being adapted to apply a localized force to said cover only in said raised region.

13. The system of claim 12 wherein said raised region is substantially aligned with said seal ring such that said raised region is adapted to apply a localized force to said cover at said seal ring.

14. The system of claim 12 wherein said raised region is formed of a pliable material such that said raised region gimbals a bonding platen thereon during securing of said cover to said substrate.

15. A method of wafer bonding, comprising:

positioning a wafer on a bonding platen, said wafer including micro-electronic devices thereon;

positioning a cover adjacent said wafer, wherein said cover includes a ring of sealing material secured to said wafer and a raised ring of material on a surface of said cover, said raised ring of material forming a continuous perimeter on said surface and positioned opposite said cover from said ring of sealing material; and

applying a bonding force only to said raised ring of material so as to seal said ring of sealing material to said wafer and to said cover only in said selected region.

16. The method of claim 15 wherein said step of applying a bond in force comprises moving a substantially planar bonding platen toward said cover wherein said bonding platen contacts only said raised ring of material.

17. The method of claim 15 wherein said bonding force is transferred through said cover from said raised ring of material to said ring of sealing material.

18. The method of claim 15 wherein said raised ring of material is formed on said cover by lithographic deposition and etch processes.

19. The method of claim 18 wherein said raised region ring of material is formed simultaneously with formation of alignment targets on said cover.

20. The method of claim 15 wherein said micro electrical devices extend upwardly a first distance from said surface of said wafer, and wherein said ring of sealing material spaces said cover from said wafer by a second distance greater than said first distance.

21. The method of claim 15 wherein said raised ring of material is manufactured of a deformable material such that said raised ring of material provides a uniform distribution of force to said cover in said selected region when said bonding force is applied to said raised ring of material.

22. The method of claim 15 wherein said raised ring of material is formed on a bonding platen and wherein said raised ring of material contacts said cover during said applying a bonding force.