Support structure for free-standing MEMS device and methods for forming the same

• US 20080055707A1
• Filed: 06/28/2006
• Published: 03/06/2008
• Est. Priority Date: 06/28/2006
• Status: Active Grant

• Current Assignee: Snaptrack Incorporated (Qualcomm, Inc.)
• Original Assignee: Qualcomm MEMS Technologies Incorporated (Qualcomm, Inc.)
• Inventors: Kogut, Lior, Tung, Ming-Hau, Arbuckle, Brian
• Granted Patent: US 7,835,061 B2
• Time in Patent Office: Days
• US Class Current: 359/291
• CPC Class Codes: B81B 3/0072 For controlling internal stress or strain in moving or flexible elements, e.g. stress compensating layers
• CPC Class Codes: G02B 26/001 based on interference in an adjustable optical cavity interference filters G02B5/28; devices or arrangements using multiple reflections in spectrometry or monochromators G01J3/26

Abstract

A microelectromechanical (MEMS) device includes a functional layer including a first material, a deformable layer including a second material different from the first material, and a connecting element including the first material. The connecting element is mechanically coupled to the deformable layer and the functional layer. The connecting element and the deformable layer form an interface between the first material and the second material. The interface is spaced from the functional layer.

Claims

1. A microelectromechanical (MEMS) device comprising:

a functional layer comprising a first material;

a deformable layer comprising a second material different from the first material; and

a connecting element comprising the first material, the connecting element mechanically coupled to the deformable layer and the functional layer, wherein the connecting element and the deformable layer form an interface between the first material and the second material, the interface spaced from the functional layer.

2. The MEMS device of claim 1, wherein the functional layer has a thickness greater than about 1 micron.

3. The MEMS device of claim 1, wherein the functional layer comprises a reflective layer.

4. The MEMS device of claim 1, wherein the functional layer comprises a contact layer and wherein the second material is substantially insulating.

5. The MEMS device of claim 1, wherein the first material comprises a conductive material.

6. The MEMS device of claim 1, wherein the first material comprises aluminum and the second material comprises nickel.

7. The MEMS device of claim 1, wherein the interface is above the deformable layer.

8. The MEMS device of claim 7, wherein the connecting element is adhered to the deformable layer.

9. The MEMS device of claim 8, wherein the interface has an area between about 80 and 1,440 square microns.

10. The MEMS device of claim 8, wherein the interface has an area between about 144 and 512 square microns.

11. The MEMS device of claim 7, wherein the connecting element is fused to the deformable layer.

12. The MEMS device of claim 1, wherein the interface is below the deformable layer.

13. The MEMS device of claim 12, wherein the connecting element is fused to the deformable layer.

14. The MEMS device of claim 12, wherein the interface has an area between about 60 and 780 square microns.

15. The MEMS device of claim 12, wherein the interface has an area between about 80 and 275 square microns.

16. The MEMS device of claim 1, further comprising:

a display;

a processor that is configured to communicate with said display, said processor being configured to process image data; and

a memory device that is configured to communicate with said processor.

17. The MEMS device of claim 16, further comprising a driver circuit configured to send at least one signal to the display.

18. The MEMS device of claim 17, further comprising a controller configured to send at least a portion of the image data to the driver circuit.

19. The MEMS device of claim 16, further comprising an image source module configured to send said image data to said processor.

20. The MEMS device of claim 19, wherein the image source module comprises at least one of a receiver, transceiver, and transmitter.

21. The MEMS device of claim 16, further comprising an input device configured to receive input data and to communicate said input data to said processor.

22. A microelectromechanical (MEMS) device comprising:

means for controlling a signal, the controlling means comprising a first material;

means for supporting the controlling means, the supporting means comprising a second material different from the first material; and

means for coupling the controlling means with the supporting means, the coupling means comprising the first material, the coupling means mechanically coupled to the supporting means and the controlling means, wherein the coupling means and the supporting means form an interface between the first material and the second material, the interface spaced from the controlling means.

23. The device of claim 22, wherein the supporting means comprises a mechanical layer.

24. The device of claim 22, wherein the controlling means comprises a reflective layer that controllably reflects an electromagnetic signal.

25. The device of claim 22, wherein the controlling means comprises a conductive layer that controllably conducts an electrical signal.

26. The device of claim 22, wherein the coupling means comprises a connecting element.

27. A method of manufacturing a microelectromechanical (MEMS) device on a substrate, the method comprising:

forming a functional layer comprising a first material;

forming a sacrificial layer over the functional layer;

forming a deformable layer comprising a second material over the sacrificial layer, the second material different from the first material;

forming a connecting element comprising the first material, the connecting element fused to the functional layer;

removing the sacrificial layer; and

mechanically coupling the connecting element to the deformable layer, wherein the connecting element and the deformable layer form an interface between the first material and the second material, the interface spaced from the functional layer.

28. The method of claim 27, wherein forming the connecting element comprises:

forming a first hole through the deformable layer and the sacrificial layer to uncover at least a portion of the functional layer;

forming a sacrificial spacer in the hole; and

depositing the first material at least partially within the sacrificial spacer and fused to the functional layer.

29. The method of claim 28, further comprising removing the sacrificial spacer.

30. The method of claim 28, wherein the sacrificial spacer at least partially overlaps the deformable layer.

31. The method of claim 28, wherein forming the sacrificial spacer comprises tapering the sides of the sacrificial spacer that contact the uncovered portion of the functional layer.

32. The method of claim 27, further comprising adhering the connecting element to the deformable layer.

33. The method of claim 27, further comprising fusing the connecting element to the deformable layer.

34. The method of claim 27, wherein forming the connecting element comprises:

forming a first hole through the sacrificial layer to uncover at least a portion of the functional layer;

depositing the first material on top of sacrificial layer and below the deformable layer, the first material fusing to the first material of the functional layer in the portion of the functional layer uncovered by the first hole; and

removing a portion of the second material proximate to the first hole.

35. The method of claim 34, wherein depositing the first material comprises physical vapor deposition of the first material.

36. The method of claim 34, wherein removing the portion of the second material, comprises:

forming a pattern over the deformable layer; and

etching the second material uncovered by the pattern.

37. The method of claim 36, wherein etching the second material comprises selectively etching the second material and negligibly etching the first material.

38. A microelectromechanical (MEMS) device fabricated by the method of claim 27.