Multi-layer cable design and method of manufacture
First Claim
1. A method of creating a flexible, light weight cable comprising the steps of:
- a) providing a central conductor [110];
b) growing a thin film dielectric layer [130] to the central conductor [110];
c) processing the dielectric layer [130] with an ion beam; and
d) metalizing the dielectric layer [130] with thin film metalizing technology.
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Accused Products
Abstract
A novel method of designing and fabricating flexible and lightweight cable [100] having a central conductor [110], a dielectric layer [130], an outer conductor [150] and an insulation coating [170] using thin film technology is disclosed. The dielectric layer [130] is ‘grown’ on dielectric layer [130] using electrophoretic deposition to a specified thickness, based upon its intended use. It may include nano-diamonds. Ion beam assisted deposition is used to metalize the cable dielectric layer [130]. This may be ion beam assisted sputtering, ion beam assisted evaporative deposition or ion beam assisted cathodic arc deposition. In an alternative embodiment, the outer conductor may be etched to provide greater flexibility, or to add a piezoelectric layer. The central conductor [110] may be created from dielectric fibers [113] which are metalized as described above. The piezoelectric layer added to create ultrasonic transducer cables.
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Citations
19 Claims
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1. A method of creating a flexible, light weight cable comprising the steps of:
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a) providing a central conductor [110];
b) growing a thin film dielectric layer [130] to the central conductor [110];
c) processing the dielectric layer [130] with an ion beam; and
d) metalizing the dielectric layer [130] with thin film metalizing technology. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A flexible, lightweight cable comprising:
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a) a central conductor [110];
b) a thin film dielectric layer [130] coating the central conductor [110] having its surface process with an ion beam; and
c) a thin film metal coating covering the dielectric layer [130] applied with thin film metalizing technology. - View Dependent Claims (14, 15, 16, 17, 18, 19)
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Specification