Multi-chip Module with Power System
3 Assignments
0 Petitions
Accused Products
Abstract
Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
27 Citations
20 Claims
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1-9. -9. (canceled)
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10. A method, comprising:
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connecting a memory and plural separate processors to a circuit board;
connecting, to form a vertically stacked configuration, a power system board to the circuit board, the power system board having plural openings;
providing a thermal dissipation device between the power system board and the circuit board;
extending a portion of the thermal dissipation device through the plural openings;
dissipating heat from a surface area of the power system board with a first surface of the thermal dissipation device; and
dissipating heat from a surface area of the plural processors with a second surface of the thermal dissipation device. - View Dependent Claims (11, 15, 16)
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12-14. -14. (canceled)
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17. An electronic module, comprising:
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a circuit board having plural separate processors;
a power board coupled, to form a vertically stacked-up configuration, to the circuit board for providing power to the circuit board, the power board having plural openings; and
a thermal dissipation device disposed between the circuit board and power board, wherein the thermal dissipation device has a top surface portion extending through the plural openings of the power board and has a bottom surface portion directly above a top surface area of the processors. - View Dependent Claims (18, 19, 20)
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Specification