HYBRID COMPOSITE WAFER CARRIER FOR WET CLEAN EQUIPMENT
First Claim
1. A carrier for supporting a substrate when being processed by passing the carrier through a meniscus formed by at least one proximity head, the carrier comprising:
- a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening;
the frame comprising a composite core, a top sheet, and a bottom sheet, and a layer of aramid fabric between the top sheet and the composite core, wherein the top sheet and the bottom sheet comprise a polymer material.
1 Assignment
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Accused Products
Abstract
A carrier structure for supporting a substrate when being processed by passing the carrier through a meniscus formed by upper and lower proximity heads is described. The carrier includes a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. The frame comprises a composite core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the core and a second layer of aramid fabric between the bottom sheet and the core. The top sheet and the bottom sheet being formed from a polymer material. A method of manufacture is also described.
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Citations
26 Claims
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1. A carrier for supporting a substrate when being processed by passing the carrier through a meniscus formed by at least one proximity head, the carrier comprising:
a frame having an opening sized for receiving a substrate and a plurality of support pins for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening;
the frame comprising a composite core, a top sheet, and a bottom sheet, and a layer of aramid fabric between the top sheet and the composite core, wherein the top sheet and the bottom sheet comprise a polymer material.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of manufacturing a carrier for supporting a substrate processed by passing the carrier through a meniscus formed by a proximity head, the method comprising:
forming a composite frame of a carbon fiber core, a top sheet, a bottom sheet, a layer of aramid fabric between the top sheet and the carbon fiber core and a second layer of aramid fabric between the bottom sheet and the carbon fiber core, the top sheet and the bottom sheet being formed from a polymer material, the frame having an opening sized for receiving a substrate, the frame also having a plurality of support pins extending into the opening for supporting the substrate within the opening, the opening being slightly larger than the substrate such that a gap exists between the substrate and the opening. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A method of making a carrier for use in preparing a substrate, comprising:
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forming body comprising a core material having a first side and a second side, the core material having a layer of thermoplastic formed over both the first side and second side of the core material; forming an opening in the body, the opening being sized to receive the substrate; applying a thermal curing cycle to the body to minimize residual stresses and reduce non-flatness characteristics of the body; applying a pressure over a top surface and edges of the thermoplastic layers to ensure confinement of the body; and machining the body to define the carrier, the machining being configured to define dimensions of the opening and outer size parameters of the carrier. - View Dependent Claims (23, 24, 25, 26)
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Specification