Modular board device, high frequency module, and method of manufacturing the same
0 Assignments
0 Petitions
Accused Products
Abstract
The present invention is directed to a high frequency module used for wireless communication module, and comprises a first organic substrate (11) in which conductive pattern or patterns are formed on the principal surface thereof and one element body (7) or more are mounted, and a second organic substrate (12) in which a recessed portion (22) is formed in correspondence with the area where the element body or bodies (7) are mounted at the connecting surface to the first organic substrate (11). In the state where the second organic substrate (12) is connected to the first organic substrate (11), an element body accommodating portion (24) which seals the element body or bodies (7) is constituted by the recessed portion (22), wherein the element body accommodating portion (24) is adapted so that moisture resistance characteristic and oxidation resistance characteristic are maintained.
-
Citations
27 Claims
-
1-10. -10. (canceled)
-
11. A method of manufacturing a module board device, including:
-
a step of mounting one element body or more onto the principal surface of a first organic substrate in which a conductive pattern or patterns has or have been formed; and a step of connecting a second organic substrate, in which a recessed portion is formed in correspondence with the area where the element body or bodies is or are mounted at a connecting surface to the first organic substrate in such a manner to seal the element body or bodies into an element body accommodating space portion constituted by the recessed portion so that the element body accommodating space portion is constituted as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained, a step of forming an insulating resin layer onto the entire surface of at least one second principal surface of the first organic substrate and the second organic substrate of the side opposite to a surface where the first organic substrate and the second organic substrate are connected to each other, a step of implementing polishing processing to the insulating resin layer to allow the second principal surface to be a planarized (flattened) build-up formation surface, and a step of forming one build-up wiring layer or more including at least one kind of passive element or more formed by the thin film technology or the thick film technology on the build-up formation surface. - View Dependent Claims (12, 13, 14, 15, 16, 17)
-
-
18-21. -21. (canceled)
-
22. A method of manufacturing a high frequency module, including;
-
a step of manufacturing a base substrate portion via a step of mounting an element body or more on the principal surface of a first organic substrate in which a conductive pattern or patterns is or are formed, a step of connecting a second organic substrate, in which a recessed portion is formed in correspondence with the area where the element body or bodies is or are mounted at a connecting surface to the first organic substrate, to the first organic substrate in such a manner to seal the element body or bodies within the element body accommodating space portion so that the element body accommodating space portion is constituted as a space portion in which moisture resistance characteristic and oxidation resistance characteristic are maintained, a step of forming an insulating resin layer onto the entire surface of at least one second principal surface of the first organic substrate and the second organic substrate of the side opposite to a surface where the first organic substrate and the second organic substrate are connected to each other, and a step of implementing polishing processing to the insulating resin layer to allow the second principal surface to be a planarized (flattened) build-up formation surface; and a step of forming a high frequency circuit portion via a step of forming one build-up wiring layer or more in which a conductive pattern or patterns is or are formed on a dielectric insulating layer formed at the build-up formation surface of the base substrate portion, and at least one kind of passive element or elements is or are formed by the thin film technology or the thick film technology, the build-up wiring layer being via-connected to the conductive pattern or patterns and/or the element body or bodies of the first organic substrate, and a step of mounting high frequency circuit components (parts) onto the build-up wiring layer of the uppermost layer. - View Dependent Claims (23, 24, 25, 26, 27)
-
Specification