Method of semiconductor device protection, package of semiconductor device
First Claim
1. A method for protecting a semiconductor device, comprising the step of:
- attaching a protection member detachably to the semiconductor device that includes one or more elements.
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Accused Products
Abstract
A method for protecting a semiconductor device is disclosed that can improve reliability of a performance test for the semiconductor device and prevent damage to the semiconductor device during transportation or packaging for shipment. An IC cover is attached to the semiconductor device, which has height unevenness because it includes semiconductor chips and electric parts having different heights. The IC cover includes projecting portions and a base portion. After being attached to the semiconductor device, the projecting portions stand in a free area in the semiconductor device, and the base portion is supported by the projections to be separated from the semiconductor chips and electric parts in the semiconductor device. The IC cover is detachably attached to the semiconductor device.
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Citations
6 Claims
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1. A method for protecting a semiconductor device, comprising the step of:
attaching a protection member detachably to the semiconductor device that includes one or more elements.
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2. A method for protecting a semiconductor device that is subjected to a plurality of treatments after fabrication but before shipment, comprising the step of:
performing the treatments with a protection member being attached to the semiconductor device. - View Dependent Claims (3)
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4. A method for testing a semiconductor device, comprising the step of:
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attaching a semiconductor device protection cover detachably to the semiconductor device; and pressing the semiconductor device against an IC contactor with the semiconductor device protection cover therebetween for a test.
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5. A semiconductor device packaging structure for packaging a semiconductor device, comprising:
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a tray including a first semi-tray and a second semi-tray, the semiconductor device being attached to and packaged in the tray; and a semiconductor device protection cover arranged between the first semi-tray and a surface of the semiconductor device, wherein the semiconductor device protection cover comprises; a base portion; a first surface, said first surface being flat; and a second surface having a projecting portion to be brought into contact with a substrate of the semiconductor device and a depressed portion not to be brought into contact with parts mounted in the semiconductor device.
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6. A semiconductor device package structure for packaging a semiconductor device, comprising:
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an embossed tape on which the semiconductor device is pasted; and a semiconductor device protection cover arranged on a surface of the semiconductor device, wherein the semiconductor device protection cover comprises; a base portion; a first surface, said first surface being flat; and a second surface having a projecting portion to be brought into contact with a substrate of the semiconductor device and a depressed portion not to be brought into contact with parts mounted in the semiconductor device.
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Specification