Wave Absorber and Manufacturing Method of Wave Absorber
First Claim
1. A wave absorber comprising a structure which sequentially laminates a conduct layer composed of an electric conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a high-resistance conductor layer having a surface resistivity within a prescribed range, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of an electric conductor;
- whereineach pattern in said pattern layer differs in either or both of size and form relative to another adjacent pattern.
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Abstract
The problem of the present invention is to offer a wave absorber that has reflection attenuation capability sufficient to enable prevention of communication disturbances due to reflection and the like of EM waves, that enables greater thinness and lighter weight, and that has wide-band attenuation properties, as well as a manufacturing method of the wave absorber. The wave absorber of the present invention has a structure which sequentially laminates a grid-like conductor layer composed of an electric conductor, a first dielectric layer, a high-resistance conductor layer having a surface resistivity within a prescribed range, a second dielectric layer, and a pattern layer having multiple patterns composed of an electric conductor, wherein each pattern in said pattern layer differs in either or both of size and form relative to another adjacent pattern.
34 Citations
46 Claims
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1. A wave absorber comprising a structure which sequentially laminates a conduct layer composed of an electric conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a high-resistance conductor layer having a surface resistivity within a prescribed range, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of an electric conductor;
- wherein
each pattern in said pattern layer differs in either or both of size and form relative to another adjacent pattern. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
- wherein
- 19. A wave absorber comprising at least a conduct layer composed of a conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a linear pattern resistance layer having linear patterns composed of a high-resistance conductor which is a conductor having a higher resistivity than said conduct layer, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of a conductor.
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22. A wave absorber comprising a structure where at least
a grid-like conductor layer formed into a grid by patterns composed of a conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a linear pattern resistance layer having linear patterns composed of a high-resistance conductor which is a conductor with a higher resistivity than the conductor that forms said grid-like conductor layer, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of a conductor are laminated in the pertinent order.
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31. A wave absorber manufacturing method comprising a process of laminating a radio wave reflection layer composed of a conductor that reflects EM waves, a first dielectric layer composed of dielectric material in one layer or multiple layers, a linear pattern resistance layer having linear patterns composed of a high-resistance conductor which is a conductor with a higher resistivity than said radio wave reflection layer, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of a conductor,
and a process of forming the linear patterns of said linear pattern resistance layer using the screen printing method.
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32. A wave absorber manufacturing method comprising a process of laminating a radio wave reflection layer composed of a conductor that reflects EM waves, a first dielectric layer composed of dielectric material in one layer or multiple layers, a linear pattern resistance layer having linear patterns composed of a high-resistance conductor which is a conductor with a higher resistivity than said radio wave reflection layer, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of a conductor,
and a process of forming the linear patterns of said linear pattern resistance layer using the ink jet method.
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33. A wave absorber comprising at least:
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a conduct layer composed of a conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a planar resistance layer composed of dielectric material containing conductive powder, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of a conductor. - View Dependent Claims (34, 35, 36, 37, 38)
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39. A wave absorber manufacturing method comprising a process of laminating a conduct layer composed of a conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a planar resistance layer composed of dielectric material containing conductive powder, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of a conductor,
and a process of forming a prepreg wherein, with respect to said planar resistance layer, said first dielectric layer and said second dielectric layer are bonded with interposition of the pertinent planar resistance layer.
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41. A wave absorber comprising a structure wherein there is sequential lamination of at least a conduct layer composed of an electric conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a high-resistance conductor layer having a surface resistivity within a prescribed range, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of an electric conductor, and
comprising a configuration wherein a protective layer which may be interposed as necessary is laminated onto at least one surface side of said conduct layer and pattern layer.
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42. A wave absorber comprising a structure wherein there is sequential lamination of a conduct layer composed of an electric conductor, a first dielectric layer composed of dielectric material in one layer or multiple layers, a high-resistance conductor layer having a surface resistivity within a prescribed range, a second dielectric layer composed of dielectric material in one layer or multiple layers, and a pattern layer having multiple patterns composed of an electric conductor, and
comprising a configuration wherein a protective layer which may be interposed as necessary is laminated onto at least one surface side of said conduct layer and pattern layer, wherein each pattern of said pattern layer differs in either or both of size and shape relative to another adjacent pattern.
Specification