Apparatus, system and method for use in mounting electronic elements
First Claim
Patent Images
1. A surface mount device comprising:
- a casing comprising a first surface, a second surface opposite said first surface, and at least one lateral side surface;
a recess formed in said first surface and extending at least partially into said casing;
a plurality of leads at least partially encased by said casing; and
one or more electronic and/or optoelectronic devices coupled with at least one of the plurality of leads and at least partially exposed through the recess.
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Abstract
The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one lateral side surface. A recess is formed in the first surface and extends into the casing. A plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.
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Citations
25 Claims
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1. A surface mount device comprising:
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a casing comprising a first surface, a second surface opposite said first surface, and at least one lateral side surface; a recess formed in said first surface and extending at least partially into said casing; a plurality of leads at least partially encased by said casing; and one or more electronic and/or optoelectronic devices coupled with at least one of the plurality of leads and at least partially exposed through the recess. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A surface mount device comprising:
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a casing comprising a first surface and a recess formed in said first surface and extending at least partially into said casing; a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing; at least one electronic device coupled with at least one of the plurality of leads and at least partially exposed through the recess; and a heat sink proximate said plurality of leads and secured in said recess. - View Dependent Claims (16, 17, 18, 19)
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20. A surface mount device comprising:
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a casing comprising a first surface and a second surface opposite said first surface; a recess formed in said first surface and extending at least partially into said casing; a lens positioned relative to and protruding from said first surface; a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing; and a heat sink secured in said recess of said casing. - View Dependent Claims (21)
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22. A method for use in manufacturing a surface mount device, the method comprising:
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positioning a plurality of leads; positioning a heat sink proximate to at least a portion of said plurality of leads; securing said plurality of leads and heat sink with a casing such that the heat sink is maintained at a predefined position relative to said leads; and mounting an electronic device on said heat sink such that at least a portion of said electronic device is exposed through a recess in said casing. - View Dependent Claims (23, 24, 25)
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Specification