Apparatus, system and method for use in mounting electronic elements

• US 9,711,703 B2
• Filed: 02/12/2008
• Issued: 07/18/2017
• Est. Priority Date: 02/12/2007
• Status: Active Grant

• Current Assignee: Cree Huizhou Solid State Lighting Company Limited (Smart Global Holdings Incorporated)
• Original Assignee: Cree Huizhou Opto Limited
• Inventors: Xie, Jian-Hui, Leung, Chi Wing, Wang, Xuan
• Primary Examiner(s): PAPE, ZACHARY
• Application Number:
  US12/069,827
• Publication Number:
  US 20080218973A1
• Time in Patent Office: 3,444 Days
• Field of Search: 36167954, 361704, 361707, 361709, 361710, 361712, 361715, 361717, 165 802, 165185, 174252, 257713, 257718, 257719, 257721, 257 98, 257 79, 257 81, 257E33062, 362373, 362382, 438 26, 438112, 438122
• CPC Class Codes: F21V 29/503 of light sources cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H01L33/64
• CPC Class Codes: F21V 29/507 of means for protecting lighting devices from damage, e.g. housings
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 23/057 the leads being parallel to the base
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: H05K 7/2039 characterised by the heat transfer by conduction from the heat generating element to a dissipating body arrangements for increasing/decreasing heat-transfer, e.g. fins details, F28F13/00

Abstract

The present invention provides various embodiments for apparatuses, systems, and methods of manufacturing surface mountable devices. Some embodiments provide surface mount devices comprising a casing with a first and second surface and at least one side surface. A recess is formed in the first surface and extends into the casing. plurality of leads is partially encased by the casing, and one or more electronic devices are coupled with at least one of the plurality of leads and are at least partially exposed through the recess. A heat sink may be included for heat dissipation.

Claims

1. A surface mount device comprising:

a casing comprising a first surface, a second surface opposite said first surface, and at least one side surface;

a recess formed in said first surface and extending at least partially into said casing;

a plurality of leads at least partially encased by said casing, wherein each of said leads comprises a surface mount area at a first end, a device coupling area at a respective opposite end, and an extended lead portion extending between said surface mount area and said device coupling area, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes, and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes;

one or more electronic or optoelectronic devices coupled with at least one of said device coupling areas, said one or more electronic or optoelectronic devices exposed through said recess; and

a heat sink comprising a raised portion and an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein at least a portion of each of said leads is in thermal contact with said raised portion, extends up the length and to the top of said raised portion, and is shaped to match the contours of and at least partially frame at least said raised portion, said one or more electronic or optoelectronic devices on a mounting surface of said heat sink, wherein said device coupling areas are proximate to said raised portion of said heat sink.

2. The surface mount device of claim 1, further comprising a lens positioned relative to and protruding from said first surface.

3. The surface mount device of claim 1, wherein at least one of said plurality of leads extends through at least one of said side surfaces, and at least one of another of said plurality of leads extends through at least one of another of said side surfaces.

4. The surface mount device of claim 1, wherein at least a portion of each of said leads is exposed outside of said casing and/or within said recess.

5. The surface mount device of claim 1, wherein said heat sink is positioned proximate to at least a portion of at least one of said plurality of leads.

6. The surface mount device of claim 1, wherein said heat sink further comprises said extended plate and a base below said extended plate and said raised portion.

7. The surface mount device of claim 6, wherein the diameter of said extended plate is greater than the diameter of said base.

8. The surface mount device of claim 6, wherein said base comprises said laterally and circumferentially extending shelf.

9. The surface mount device of claim 6, wherein the diameter at the base of said raised portion is greater than the diameter at the top of said raised portion.

10. The surface mount device of claim 1, wherein said heat sink comprises the mounting surface coupled with said one or more electronic or optoelectronic devices.

11. The surface mount device of claim 1, wherein said heat sink comprises at least one through-hole.

12. The surface mount device of claim 11, wherein said casing extends through at least one through-hole.

13. The surface mount device of claim 1, wherein said mounting surface of said heat sink comprises a recessed mounting surface.

14. The surface mount device of claim 1, wherein said plurality of leads extends from the recess through the casing and exits the casing.

15. A surface mount device comprising:

a casing comprising a first surface, a recess formed in said first surface and extending at least partially into said casing, and at least one side surface;

a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing, wherein each of said leads comprises a surface mount area, a device coupling area, and an extended lead portion extending therebetween, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes;

at least one electronic device coupled with at least one of said device coupling areas and at least partially exposed through the recess; and

a heat sink proximate said plurality of leads and secured in said recess, said heat sink comprising a raised portion at least partially framed by portions of said leads in thermal contact with said raised portion and extending up the length and to the top of said raised portion, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, said at least one electronic device on a mounting surface of said heat sink, wherein said device coupling areas are proximate to said raised portion of said heat sink.

16. The surface mount device of claim 15, further comprising a lens positioned relative to and protruding from said first surface.

17. The surface mount device of claim 15, wherein said heat sink further comprises:

an extended plate and a base below said extended plate;

the mounting surface coupled with the at least one electronic device; and

at least one through-hole.

18. The surface mount device of claim 17, wherein said heat sink is coupled with at least one of said plurality of leads.

19. The surface mount device of claim 17, wherein said casing extends through at least one through-hole.

20. The surface mount device of claim 15, wherein said mounting surface of said heat sink comprises a recessed mounting surface.

21. A surface mount device comprising:

a casing comprising a first surface, a second surface opposite said first surface, and at least one side surface;

a recess formed in said first surface and extending at least partially into said casing;

a lens positioned relative to and protruding from said first surface;

a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing, wherein each of said leads comprises a surface mount area, a device coupling area, and an extended lead portion extending between the surface mount and device coupling areas, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes and wherein said device coupling areas are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes; and

a heat sink secured in said recess of said casing, said heat sink comprising a raised portion at least partially framed by portions of said leads in thermal contact with said raised portion and extending up the length and to the top of said raised portion, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein said device coupling areas are proximate to said raised portion of said heat sink.

22. The surface mount device of claim 21, wherein one or more electronic and/or optoelectronic devices are coupled with at least one of said plurality of leads and are at least partially exposed through the recess.

23. The surface mount device of claim 21, wherein said heat sink comprises a recessed mounting surface.

24. The surface mount device of claim 21, wherein said heat sink comprises at least one through-hole.

25. The surface mount device of claim 24, wherein said casing extends through the at least one through-hole.

26. A method for use in manufacturing a surface mount device, the method comprising:

providing a casing with at least one side surface;

positioning a plurality of leads, wherein each of said leads comprises a surface mount area at a first end, a device coupling area at a respective opposite end, and an extended lead portion extending between said surface mount area and said device coupling area, wherein said extended lead portion comprises a width less than the width of said surface mount area, wherein at least one of said extended lead portions extends along said at least one side surface, wherein said leads are angled to align said device coupling areas along first and second perpendicular axes, and wherein said device coupling area are narrower than the widths of said extended lead portions, said device coupling areas straddling said first and second perpendicular axes;

positioning a heat sink proximate to at least a portion of said plurality of leads, said heat sink comprising a raised portion at least partially framed by portions of said leads in thermal contact with said raised portion and extending up the length and to the top of said raised portion, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said raised portion protrudes from said extended plate, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said heat sink, wherein said casing comprises a material that is partially below said extended plate and adjacent to said shelf, wherein said device coupling areas are proximate to said raised portion of said heat sink;

securing said plurality of leads and heat sink with said casing such that the heat sink is maintained at a predefined position relative to said leads; and

mounting an electronic device on a mounting surface of said heat sink such that at least a portion of said electronic device is exposed through a recess in said casing.

27. The method of claim 26, wherein securing said plurality of leads and heat sink with the casing comprises:

securing the plurality of leads with the casing such that at least a portion of at least one of the plurality of leads is exposed through said recess and at least a portion of at least one of the plurality of leads is exposed outside said casing; and

securing the heat sink with the casing such that at least a portion of a contact surface and at least a portion of the mounting surface of the heat sink are exposed through said casing.

28. The method of claim 26, wherein a lens is formed about said recess effectively covering said exposed portion of the mounted device.

29. The method of claim 26, wherein said mounting surface of said heat sink comprises a recessed mounting surface.

30. The method of claim 26, wherein said heat sink comprises at least one through-hole.

31. The method of claim 30, wherein said casing extends through the at least one through-hole.

32. The method of claim 26, wherein said plurality of leads extends from the recess through the casing and exiting the casing.

33. A surface mount device comprising:

a casing comprising a first surface and a recess formed in said first surface and extending at least partially into said casing;

a plurality of leads at least partially encased by said casing and extending from the recess through the casing and exiting the casing;

at least one electronic device coupled with at least one of the plurality of leads and at least partially exposed through the recess; and

a heat sink proximate said plurality of leads and secured in said recess, said heat sink comprising an extended plate and a laterally and circumferentially extending shelf, wherein said shelf comprises first and second opposing lateral surfaces and a tapered circumferential perimeter connecting the first and second opposing lateral surfaces and tapered toward a central axis of said jheat sink, wherein said extended plate is positioned between said extending shelf and a pedestal section of said heat sink.

34. The surface mount device of claim 33, further comprising a lens positioned relative to and protruding from said first surface.

35. The surface mount device of claim 33, wherein said at least one electronic device comprises one or more light emitting diodes (LEDs).

36. The surface mount device of claim 33, wherein said heat sink comprises at least one through-hole, and wherein said casing extends through said at least one through-hole.