Semiconductor module and method for manufacturing semiconductor module

• US 20080284007A1
• Filed: 04/28/2008
• Published: 11/20/2008
• Est. Priority Date: 05/18/2007
• Status: Active Grant

• Current Assignee: Fuji Electric Company Limited (Fuji Electric Systems Company Limited)
• Original Assignee: Fuji Electric Device Technology Company Limited (Fuji Electric Systems Company Limited)
• Inventors: Maruyama, Rikihiro, Mochizuki, Eiji, Nishizawa, Tatsuo, Horio, Masafumi
• Granted Patent: US 7,902,653 B2
• Time in Patent Office: Days
• US Class Current: 257/734
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 25/072 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/3511 Warping

Abstract

A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.

Claims

1. A semiconductor module, comprising:

a first metal foil;

an insulating sheet mounted on a top surface of the first metal foil;

at least one second metal foil mounted on a top surface of the insulating sheet;

at least one semiconductor device mounted on the at least one second metal foil;

a resin case for surrounding the first metal foil, at least one second metal foil, the insulating sheet, and the at least one semiconductor device, said resin case having a peripheral wall with a bottom end located above a bottom surface of the first metal foil; and

resin filling a space inside the resin case relative to the first metal foil, at least one second metal foil, the insulating sheet and the at least one semiconductor device, wherein the bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.

2. A semiconductor module according to claim 1, further comprising a fastening portion integrally formed with the resin case at a periphery thereof, said fastening portion being filled with the resin and having a hole penetrating the fastening portion and the resin inside the resin case.

3. A semiconductor module according to claim 1, wherein the resin comprises an epoxy resin as a main component.

4. A semiconductor module according to claim 1, wherein the resin case includes at least one protruding portion on an inner surface thereof.

5. A semiconductor module according to claim 1, wherein the first metal foil has a convex portion projecting outwardly.

6. A semiconductor module according to claim 1, wherein said first and second metal foils have thermal expansion coefficients substantially same as that of the resin inside the resin case.

7. A semiconductor module according to claim 1, further comprising a thermal compound provided on a bottom surface of the first metal foil so that a cooling effect is enhanced.

8. A method for manufacturing a semiconductor module, comprising the steps of:

preparing a board comprising a first metal foil, an insulating sheet mounted on a top surface of the first metal foil, and at least one second metal foil mounted on a top surface of the insulating sheet;

mounting at least one semiconductor device on the at least one second metal foil;

placing a resin case onto the board for surrounding the first metal foil, insulating sheet, at least one second metal foil, and at least one semiconductor device, a bottom end of a peripheral wall of the resin case being located above a bottom surface of the first metal;

pouring a resin in a paste form into the resin case to fill a space relative to the first metal foil, insulating sheet, at least one second metal foil and at least one semiconductor device; and

heat-curing the resin, wherein the bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.

9. A method for manufacturing a semiconductor module according to claim 8, further comprising:

mounting a lid portion of the resin case having at least one lead frame on the board to contact the lead frame with the at least one second metal foil;

electrically connecting the lead frame and the at least one second metal foil; and

placing an outer frame portion of the resin case on the board on which the lid portion has been placed.

10. A method for manufacturing a semiconductor module according to claim 8, wherein the first metal foil is convex toward the external mounting member after heat-curing step.