Semiconductor module and method for manufacturing semiconductor module
First Claim
1. A semiconductor module, comprising:
- a first metal foil;
an insulating sheet mounted on a top surface of the first metal foil;
at least one second metal foil mounted on a top surface of the insulating sheet;
at least one semiconductor device mounted on the at least one second metal foil;
a resin case for surrounding the first metal foil, at least one second metal foil, the insulating sheet, and the at least one semiconductor device, said resin case having a peripheral wall with a bottom end located above a bottom surface of the first metal foil; and
resin filling a space inside the resin case relative to the first metal foil, at least one second metal foil, the insulating sheet and the at least one semiconductor device, wherein the bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member.
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Accused Products
Abstract
A semiconductor module includes a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the second metal foil; and a resin case for surrounding the first metal foil, insulating sheet, second metal foil, and semiconductor device. A bottom end of a peripheral wall of the resin case is located above a bottom surface of the first metal foil. A resin is provided inside the resin case to fill the inside of the resin case. The bottom surface of the first metal foil and the resin form a flat bottom surface so that the flat bottom surface contacts an external mounting member.
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Citations
10 Claims
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1. A semiconductor module, comprising:
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a first metal foil; an insulating sheet mounted on a top surface of the first metal foil; at least one second metal foil mounted on a top surface of the insulating sheet; at least one semiconductor device mounted on the at least one second metal foil; a resin case for surrounding the first metal foil, at least one second metal foil, the insulating sheet, and the at least one semiconductor device, said resin case having a peripheral wall with a bottom end located above a bottom surface of the first metal foil; and resin filling a space inside the resin case relative to the first metal foil, at least one second metal foil, the insulating sheet and the at least one semiconductor device, wherein the bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method for manufacturing a semiconductor module, comprising the steps of:
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preparing a board comprising a first metal foil, an insulating sheet mounted on a top surface of the first metal foil, and at least one second metal foil mounted on a top surface of the insulating sheet; mounting at least one semiconductor device on the at least one second metal foil; placing a resin case onto the board for surrounding the first metal foil, insulating sheet, at least one second metal foil, and at least one semiconductor device, a bottom end of a peripheral wall of the resin case being located above a bottom surface of the first metal; pouring a resin in a paste form into the resin case to fill a space relative to the first metal foil, insulating sheet, at least one second metal foil and at least one semiconductor device; and heat-curing the resin, wherein the bottom surface of the first metal foil and the resin form a flat bottom surface to contact an external mounting member. - View Dependent Claims (9, 10)
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Specification