Leadframe Strip and Mold Apparatus for an Electronic Component and Method of Encapsulating an Electronic Component
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Abstract
A leadframe strip comprises a plurality of units arranged in a line. Each unit provides two component positions, each having a chip support substrate. The chip support substrates of the two component positions are mechanically linked by at least one support bar. The two component positions of a unit are molded at essentially the same time to produce a plastic housing for a package in each component position. The central portion of the first support bars remains outside of the plastic housing of the two packages.
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Citations
60 Claims
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1-35. -35. (canceled)
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36. A leadframe strip comprising:
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a plurality of units arranged in a line, each of the plurality of units providing two component positions, each component position comprising; a chip support substrate; a drain lead extending from the chip support substrate in a direction; at least one source lead and at least one gate lead, whereby the source lead and the gate lead each extend in a direction parallel to the drain lead and each have an inner portion with an inner bonding area and an outer portion, whereby the end of the inner lead portions of the source lead and of the gate lead are spaced from the chip support substrate, and wherein the source lead, the gate lead and the drain lead are located on one side of the chip support substrate and are coupled by a tie bar; the chip support substrates of the component positions of the unit being disposed adjacent to each other; and at least one first support bar extending between the chip support substrates of the two component positions of each unit in a direction parallel to the drain lead. - View Dependent Claims (37, 38, 39, 40, 41, 42, 43, 44, 45)
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46. A method for encapsulating electronic components comprising:
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providing a leadframe strip having two component positions, each component position including a chip support substrate having a drain lead extending from the chip support substrate and a source lead and a gate lead; providing a plurality of semiconductor chips, each semiconductor chip having a source electrode, a gate electrode and a drain electrode coupled together by a tie bar; mounting the plurality of semiconductor chips on respective ones of the chip support substrates; electrically connecting the gate electrode with an inner bonding area of the gate lead and the source electrode with an inner bonding area of the source lead by a plurality of bond wires; electrically connecting the drain electrode with the drain lead; encapsulating the semiconductor chips, the bond wires and the inner bonding areas of the source lead and of the gate lead in plastic material to form a component housing in each component position by a transfer mold process; wherein each component position is encapsulated at essentially the same time; and wherein a central portion of a first support bar extending between the chip support substrates of the two component positions remains outside of the component housings. - View Dependent Claims (47, 48, 49, 50, 51, 52)
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53. A mold apparatus comprising:
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an upper part having a wall thickness and a lower part having a wall thickness, the upper part and the lower part, when placed together, providing two cavities of essentially the same dimensions; wherein the two cavities are spaced apart from one another, are located laterally adjacent to one another and lie in essentially the same plane; wherein each cavity has an outer side wall and an opposing inner side wall, the inner side wall of the cavities being positioned adjacent one another; wherein, when the upper part and the lower part are placed together, each outer side wall further comprises three first channels which extend through the thickness of the outer side wall in essentially parallel directions, the dimensions of each first channel being adapted to accommodate a drain lead, a source lead or a gate lead; wherein, when the upper part and the lower part are placed together, each inner side wall further comprises at least one second channel which extends through the thickness of the inner side wall in a direction essentially parallel to the three first channels in the outer side wall, the dimensions of the second channel being adapted to accommodate a first support bar; wherein the second channels of the inner side walls are laterally aligned with one another; and wherein a further through-hole is provided, the through-hole being suitable for the injection of mold compound into the cavities. - View Dependent Claims (54, 55, 56, 57, 58, 59, 60)
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Specification