Programmable semiconductor interposer for electronic package and method of forming
First Claim
1. A semiconductor interposer comprising:
- a substrate;
an array of semiconductor devices having various electrical parameters formed in said substrate;
one or more first conductive contact pads formed on a first surface of said substrate;
one or more second conductive contact pads formed on a second surface of said substrate;
one or more conductive paths passing through said substrate and connecting at least one of the first contact pads to at least one of the second contact pads;
a device selection unit formed in said substrate;
wherein said device selection unit selectively connects at least one of said devices to said first contact pads and forms a virtual element having a desired electrical parameter.
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Accused Products
Abstract
Various structures of a programmable semiconductor interposer for electronic packaging are described. An array of semiconductor devices having various values is formed in said interposer. A user can program said interposer and form a “virtual” device having a desired value by selectively connecting various one of the array of devices to contact pads formed on the surface of said interposer. An inventive electronic package structure includes a standard interposer having an array of unconnected devices of various values and a device selection unit, which selectively connects various one of the array of devices in said standard interposer to an integrated circuit die encapsulated in said electronic package. Methods of forming said programmable semiconductor interposer and said electronic package are also illustrated.
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Citations
20 Claims
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1. A semiconductor interposer comprising:
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a substrate; an array of semiconductor devices having various electrical parameters formed in said substrate; one or more first conductive contact pads formed on a first surface of said substrate; one or more second conductive contact pads formed on a second surface of said substrate; one or more conductive paths passing through said substrate and connecting at least one of the first contact pads to at least one of the second contact pads; a device selection unit formed in said substrate; wherein said device selection unit selectively connects at least one of said devices to said first contact pads and forms a virtual element having a desired electrical parameter. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor interposer comprising:
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a substrate; an array of passive semiconductor devices having various electrical parameters formed in said substrate; one or more first conductive contact pads formed on a first surface of said substrate; one or more second conductive contact pads formed on a second surface of said substrate; one or more conductive paths passing through said substrate and connecting at least one of the first contact pads to at least one of the second contact pads; wherein said devices can be selectively connected to each other to form a virtual element having a desired electrical parameter and be connected to said first contact pads. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18)
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19. An electronic package comprising:
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at least one semiconductor interposer which includes a substrate, one or more first conductive contact pads formed on a first surface of said substrate, one or more second conductive contact pads formed on a second surface of said substrate, one or more conductive paths passing through said substrate and connecting at least one of the first contact pads to at least one of the second contact pads, an array of passive semiconductor devices having various electrical parameters formed in said substrate, wherein said passive semiconductor devices can be selectively connected to each other and be connected to said first contact pads and form a virtual element having a desired electrical parameter; and at least one semiconductor integrated circuit die electrically coupled to said interposer. - View Dependent Claims (20)
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Specification