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Integrated Motion Processing Unit (MPU) With MEMS Inertial Sensing And Embedded Digital Electronics

  • US 20090007661A1
  • Filed: 07/06/2007
  • Published: 01/08/2009
  • Est. Priority Date: 07/06/2007
  • Status: Active Grant
First Claim
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1. A module operable to be mounted onto a surface of a board, the module comprising:

  • a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, the accelerometer being formed on a first substrate;

    a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis, the first rotation sensor being formed on the first substrate; and

    an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor, the application specific integrated circuit (ASIC) comprising an analog-to-digital converter (ADC) and being implemented on a second substrate,wherein the first substrate is vertically bonded to the second substrate.

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