Integrated Motion Processing Unit (MPU) With MEMS Inertial Sensing And Embedded Digital Electronics
First Claim
1. A module operable to be mounted onto a surface of a board, the module comprising:
- a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, the accelerometer being formed on a first substrate;
a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis, the first rotation sensor being formed on the first substrate; and
an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor, the application specific integrated circuit (ASIC) comprising an analog-to-digital converter (ADC) and being implemented on a second substrate,wherein the first substrate is vertically bonded to the second substrate.
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Accused Products
Abstract
A module operable to be mounted onto a surface of a board. The module includes a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, and a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis. The accelerometer and the first rotation sensor are formed on a first substrate. The module further includes an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor. The ASIC includes an analog-to-digital converter and is implemented on a second substrate. The first substrate is vertically bonded to the second substrate.
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Citations
23 Claims
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1. A module operable to be mounted onto a surface of a board, the module comprising:
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a linear accelerometer to provide a first measurement output corresponding to a measurement of linear acceleration in at least one axis, the accelerometer being formed on a first substrate; a first rotation sensor operable to provide a second measurement output corresponding to a measurement of rotation about at least one axis, the first rotation sensor being formed on the first substrate; and an application specific integrated circuit (ASIC) to receive both the first measurement output from the linear accelerometer and the second measurement output from the first rotation sensor, the application specific integrated circuit (ASIC) comprising an analog-to-digital converter (ADC) and being implemented on a second substrate, wherein the first substrate is vertically bonded to the second substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification