Semiconductor Light Emitting Element
First Claim
1. A semiconductor light emitting element comprising:
- a substrate;
a p-type semiconductor layer supported by the substrate;
an n-type semiconductor layer provided at a position farther from the substrate than the p-type semiconductor layer is; and
an active layer provided between the p-type semiconductor layer and the n-type semiconductor layer;
the n-type semiconductor layer being provided with a rectangular n-side electrode whose width in one direction is equal to that of the n-type semiconductor layer,the n-type semiconductor layer having a thickness t that satisfies Formula 1 given below,the semiconductor light emitting element including a side surface extending in a lamination direction and being formed with a plurality of projections,the projections having bottom widths an average WA of which satisfies WA≧
λ
/n when a wavelength of light emitted from the active layer is λ and
index of refraction of one of the n-type semiconductor layer and the p-type semiconductor layer is n,wherein Formula 1 is;
where L is width of the n-type semiconductor layer in a direction which is different from said one direction, T is absolute temperature, W is width of the n-side electrode in a direction which is different from said one direction, J0 is current density at a contact portion between the n-side electrode and the n-type semiconductor layer, e is elementary charge, γ
is diode ideality factor, κ
B is Boltzmann constant, and ρ
is specific resistance of the n-type semiconductor layer.
1 Assignment
0 Petitions
Accused Products
Abstract
In a semiconductor light emitting element, a p-type layer (220), an active layer (230) and an n-type layer (240) are laminated on a substrate in this order. The n-type layer (240) is formed with a rectangular n-side electrode (241) whose width in one direction is equal to that of the n-type layer (240). The thickness t of the n-type layer (240) satisfies Formula 1 below. The semiconductor light emitting element includes a side surface (270) extending in the lamination direction and formed with a plurality of projections (271). Supposing that the wavelength of the light from the active-layer (230) is λ and the index of refraction of the n-type layer (240) or the p-type layer (220) is n, the average WA of widths at bottoms of the projections is set to satisfy WA≧λ/n.
-
- where L is width of the n-type layer in a direction different from the one direction,
- T is absolute temperature,
- W is width of the n-side electrode in a direction different from the one direction,
- J0 is current density at the contact portion between the n-side electrode and the n-type layer,
- e is elementary charge,
- γ is diode ideality factor,
- κB is Boltzmann constant,
- ρ is specific resistance of the n-type semiconductor layer.
30 Citations
10 Claims
-
1. A semiconductor light emitting element comprising:
-
a substrate; a p-type semiconductor layer supported by the substrate; an n-type semiconductor layer provided at a position farther from the substrate than the p-type semiconductor layer is; and an active layer provided between the p-type semiconductor layer and the n-type semiconductor layer; the n-type semiconductor layer being provided with a rectangular n-side electrode whose width in one direction is equal to that of the n-type semiconductor layer, the n-type semiconductor layer having a thickness t that satisfies Formula 1 given below, the semiconductor light emitting element including a side surface extending in a lamination direction and being formed with a plurality of projections, the projections having bottom widths an average WA of which satisfies WA≧
λ
/n when a wavelength of light emitted from the active layer is λ and
index of refraction of one of the n-type semiconductor layer and the p-type semiconductor layer is n,wherein Formula 1 is; where L is width of the n-type semiconductor layer in a direction which is different from said one direction, T is absolute temperature, W is width of the n-side electrode in a direction which is different from said one direction, J0 is current density at a contact portion between the n-side electrode and the n-type semiconductor layer, e is elementary charge, γ
is diode ideality factor,κ
B is Boltzmann constant, andρ
is specific resistance of the n-type semiconductor layer.
-
-
2. A semiconductor light emitting element comprising:
-
a substrate; and an n-type semiconductor layer, an active layer and a p-type semiconductor layer which are laminated on the substrate; wherein the semiconductor light emitting element includes a side surface extending in a lamination direction and formed with a plurality of projections, wherein, when a wavelength of light emitted from the active layer is expressed by λ and
index of refraction of either one of the n-type semiconductor layer and the p-type semiconductor layer is expressed by n, average WA of widths at bottoms of the projections satisfies;
WA≧
λ
/n. - View Dependent Claims (3, 4)
-
-
5. A semiconductor light emitting element comprising:
-
a substrate; a p-type semiconductor layer supported by the substrate; an n-type semiconductor layer arranged at a position farther from the substrate than the p-type semiconductor layer is; and an active layer arranged between the p-type semiconductor layer and the n-type semiconductor layer; wherein the n-type semiconductor layer is formed with a circular n-side electrode, wherein the n-type semiconductor layer has a thickness t which satisfies Formula 2; where L is representative length of the semiconductor light emitting element, T is absolute temperature, W is diameter of the n-side electrode, J0 is current density at a contact portion between the n-side electrode and the n-type semiconductor layer, e is elementary charge, γ
is diode ideality factor,κ
B is Boltzmann constant, andρ
is specific resistance of the n-type semiconductor layer.- View Dependent Claims (6, 7)
where 0.1 μ
m≦
x≦
3.0 μ
m.
-
-
7. The semiconductor light emitting element according to claim 5, wherein the n-type semiconductor layer is made of n-GaN.
-
8. A semiconductor light emitting element comprising:
-
a substrate; a p-type semiconductor layer supported by the substrate; an n-type semiconductor layer arranged at a position farther from the substrate than the p-type semiconductor layer is; and an active layer arranged between the p-type semiconductor layer and the n-type semiconductor layer; wherein the n-type semiconductor layer is formed with a rectangular n-side electrode whose width in one direction is equal to that of the n-type semiconductor layer, wherein the n-type semiconductor layer has a thickness t which satisfies Formula 4 given below; where L is width of the n-type semiconductor layer in a direction which is different from said one direction, T is absolute temperature, W is width of the n-side electrode in a direction which is different from said one direction, J0 is current density at a contact portion between the n-side electrode and the n-type semiconductor layer, e is elementary charge, γ
is diode ideality factor,κ
B is Boltzmann constant, andρ
is specific resistance of the n-type semiconductor layer.- View Dependent Claims (9, 10)
where 0.1 μ
m≦
x≦
3.0 μ
m.
-
-
10. The semiconductor light emitting element according to claim 8, wherein the n-type semiconductor layer is made of n-GaN.
Specification