METHOD FOR BONDING A TANTALUM STRUCTURE TO A COBALT-ALLOY SUBSTRATE
First Claim
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1. A method for bonding a porous tantalum structure to a substrate, comprising:
- providing a substrate comprising cobalt or a cobalt-chromium alloy;
providing an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof;
providing a porous tantalum structure;
applying heat and pressure to the substrate and the interlayer for a time sufficient to achieve solid-state diffusion between the substrate and the interlayer; and
applying heat and pressure to the interlayer and the porous tantalum structure for a time sufficient to achieve solid-state diffusion between the interlayer and the porous tantalum structure.
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Abstract
A method for bonding a porous tantalum structure to a substrate is provided. The method comprises providing a substrate comprising cobalt or a cobalt-chromium alloy; an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; and a porous tantalum structure. Heat and pressure are applied to the substrate, the interlayer, and the porous tantalum structure to achieve solid-state diffusion between the substrate and the interlayer and between the interlayer and the porous tantalum structure.
122 Citations
25 Claims
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1. A method for bonding a porous tantalum structure to a substrate, comprising:
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providing a substrate comprising cobalt or a cobalt-chromium alloy; providing an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof; providing a porous tantalum structure; applying heat and pressure to the substrate and the interlayer for a time sufficient to achieve solid-state diffusion between the substrate and the interlayer; and applying heat and pressure to the interlayer and the porous tantalum structure for a time sufficient to achieve solid-state diffusion between the interlayer and the porous tantalum structure. - View Dependent Claims (2, 3, 4)
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5. A method for bonding a porous tantalum structure to a substrate, comprising:
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providing a substrate comprising cobalt or a cobalt-chromium alloy; applying an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof to a surface of the substrate; positioning a porous tantalum structure in contact with the interlayer, thereby forming an assembly; and applying heat and pressure to the assembly for a time sufficient to achieve solid-state diffusion between the substrate and the interlayer and solid-state diffusion between the interlayer and the porous tantalum structure. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method for bonding a porous tantalum structure to a substrate, comprising:
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providing a substrate comprising cobalt or a cobalt-chromium alloy; positioning an interlayer sheet having a thickness of at least about 0.016 inches, the interlayer sheet comprising at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof in contact with the substrate; positioning a porous tantalum structure in contact with the interlayer sheet, thereby forming an assembly; applying a pressure of at least about 200 psi to the assembly; and heating the assembly to at least about 540°
C. for at least one hour to achieve solid-state diffusion between the substrate and the interlayer sheet and between the interlayer sheet and the porous tantalum structure.
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16. A method for bonding a porous tantalum structure to a substrate, comprising:
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providing a substrate comprising cobalt or a cobalt-chromium alloy; applying an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof to a surface of the substrate; applying heat and pressure to the interlayer and the substrate for a time sufficient to achieve solid-state diffusion between the substrate and the interlayer thereby forming a subassembly; positioning a porous tantalum structure in contact with the interlayer portion of the subassembly thereby forming an assembly; and applying heat and pressure to the assembly for a time sufficient to achieve solid-state diffusion between the interlayer and the porous tantalum structure. - View Dependent Claims (17, 18, 19, 20)
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21. A method for bonding a porous tantalum structure to a substrate, comprising:
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providing a porous tantalum structure; applying an interlayer consisting essentially of at least one of hafnium, manganese, niobium, palladium, zirconium, titanium, or alloys or combinations thereof to a surface of the porous tantalum structure; applying heat and pressure to the interlayer and the porous tantalum structure for a time sufficient to achieve solid-state diffusion between the porous tantalum structure and the interlayer thereby forming a subassembly; positioning a substrate comprising cobalt or a cobalt-chromium alloy in contact with the interlayer portion of the subassembly thereby forming an assembly; and applying heat and pressure to the assembly for a time sufficient to achieve solid-state diffusion between the interlayer and the substrate. - View Dependent Claims (22, 23, 24, 25)
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Specification