Method for Producing Internal Antenna with Anti-Electromagnetic Interference Property Through Vacuum Process
First Claim
1. A method for producing an internal antenna with anti-electromagnetic interference property by performing a vacuum process, comprising:
- (a) performing a surface pretreatment process on an insulating substrate to clean the surface of the insulating substrate;
(b) performing a vacuum process, comprising;
(b-1) sputtering a conductive layer on the insulating substrate, wherein the insulating substrate is placed into a vacuum chamber and a first plasma bombardment is performed by using a conductive target material, such that surface components of the conductive target material are sputtered in a form of atoms for being deposited and covered on the whole insulating substrate;
(b-2) sputtering a passivation layer on the conductive layer, wherein the insulating substrate is placed into another vacuum chamber, and a second plasma bombardment is performed by using a passivation target material, such that surface components of the passivation target material are sputtered in as a form of atoms for being deposited and covered on the conductive layer; and
(c) removing a certain part of the passivation layer and the conductive layer, so that a planar antenna pattern is remained with a certain distance spaced apart from the surrounding passivation layer and conductive layer.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for producing an internal antenna with an anti-electromagnetic interference property by performing a vacuum process, which includes (1) performing a surface pretreatment process on an insulating substrate to clean the surface thereof, (2) placing the substrate into a vacuum chamber, and performing a first plasma bombardment by using a conductive target material; (3) placing the substrate into another vacuum chamber, and performing a second plasma bombardment by using a passivation target material; (4) removing a certain part of the passivation layer and the conductive layer, such that a planar antenna pattern is remained with a certain distance spaced apart from the surrounding passivation layer and conductive layer. The conductive layer and the passivation layer cover the surface of the substrate for completely shielding the electromagnetic interference, and meanwhile, the planar shape of the antenna saves the cost and the available space within the housing.
-
Citations
20 Claims
-
1. A method for producing an internal antenna with anti-electromagnetic interference property by performing a vacuum process, comprising:
-
(a) performing a surface pretreatment process on an insulating substrate to clean the surface of the insulating substrate; (b) performing a vacuum process, comprising; (b-1) sputtering a conductive layer on the insulating substrate, wherein the insulating substrate is placed into a vacuum chamber and a first plasma bombardment is performed by using a conductive target material, such that surface components of the conductive target material are sputtered in a form of atoms for being deposited and covered on the whole insulating substrate; (b-2) sputtering a passivation layer on the conductive layer, wherein the insulating substrate is placed into another vacuum chamber, and a second plasma bombardment is performed by using a passivation target material, such that surface components of the passivation target material are sputtered in as a form of atoms for being deposited and covered on the conductive layer; and (c) removing a certain part of the passivation layer and the conductive layer, so that a planar antenna pattern is remained with a certain distance spaced apart from the surrounding passivation layer and conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A method for producing an internal antenna with anti-electromagnetic interference property by performing a vacuum process, comprising:
-
(a) performing a surface pretreatment process on an insulating substrate to clean the surface of the insulating substrate; (b) performing a vacuum process, comprising; (b-1) sputtering a conductive layer on the insulating substrate, wherein the insulating substrate is placed into a vacuum chamber and a first evaporation process is performed to vaporize a conductive material, such that the conductive material is deposited on the whole insulating substrate to form the conductive layer after performing a cooling process; (b-2) sputtering a passivation layer on the conductive layer, wherein the insulating substrate is placed into another vacuum chamber, and a second evaporation process is performed to vaporize a passivation material, such that the passivation material is deposited on the conductive layer to form the passivation layer after performing a cooling process; and (c) removing a certain part of the passivation layer and the conductive layer, so that a planar antenna pattern is remained with a certain distance spaced apart from the surrounding passivation layer and conductive layer. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
-
Specification