ELECTRICALLY ENHANCED WIREBOND PACKAGE
First Claim
1. An integrated circuit (IC) device in packaging having electrically insulated connections, comprising:
- a semiconductor device mounted onto an attachment area, the semiconductor device having a plurality of bonding pads;
a lead frame surrounding the die attachment area, the lead frame having a plurality of bonding fingers;
a plurality of mutually isolated connection conductors having respective first ends attached to respective bonding pads on the semiconductor device and having respective second respective second ends attached to respective bonding fingers of the lead frame; and
an insulating material coating at least a portion of the plurality of mutually isolated connection conductors.
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Accused Products
Abstract
Consistent with an example embodiment, there is an integrated circuit (IC) device in a packaging having electrically insulated connections. The IC device comprises a semiconductor device (100) mounted onto a die attachment area (10); the semiconductor device has a plurality of bonding pads (20a, 25a, 30a, 35a). A lead frame having a plurality of bonding fingers (20b, 25b, 30b, 35b) surrounds the die attachment area. A plurality of mutually isolated connection conductors (25d, 30d, 40, 50) having respective first ends are attached to respective bonding pads on the semiconductor device and the plurality of mutually isolated connection conductors having respective second respective second ends are attached to respective bonding fingers of the lead frame. An insulating material (45) coats at least a portion of the plurality of mutually isolated connection conductors. The mutually isolated connection conductors may include a bond wire (40,50) for the signal connection and a conductive strap (25d,30d) for the voltage reference connection. The insulating material (45) coating the bond wires reduces the likelihood of short circuits during encapsulation.
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Citations
16 Claims
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1. An integrated circuit (IC) device in packaging having electrically insulated connections, comprising:
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a semiconductor device mounted onto an attachment area, the semiconductor device having a plurality of bonding pads; a lead frame surrounding the die attachment area, the lead frame having a plurality of bonding fingers; a plurality of mutually isolated connection conductors having respective first ends attached to respective bonding pads on the semiconductor device and having respective second respective second ends attached to respective bonding fingers of the lead frame; and an insulating material coating at least a portion of the plurality of mutually isolated connection conductors. - View Dependent Claims (2, 3, 4, 5, 6)
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7. An integrated circuit (IC) device in a BGA package substrate, the BGA package substrate having electrically insulated connections, comprising:
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a semiconductor device mounted onto an attachment area, the semiconductor device having bonding pads; bonding fingers surrounding the die attachment area; a plurality of mutually isolated connection conductors having respective first ends attached to respective bonding pads on the semiconductor device and having respective second ends attached to respective bonding fingers, and an insulating material coating at least a portion of the plurality of mutually isolated connection conductors. - View Dependent Claims (8, 9)
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10. An integrated circuit (IC) device in a package substrate, the package substrate having electrically insulated connections, comprising:
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a semiconductor device mounted onto an attachment area, the semiconductor device having bonding pads; bonding fingers surrounding the die attachment area; signal connection conductors having respective first ends attached to respective bonding pads on the semiconductor device and having respective second ends attached to respective bonding fingers, wherein a number of the signal connection conductors are bond wires coated with a resilient insulating coating; voltage reference conductors having respective first ends attached to respective bonding pads on the semiconductor device and having respective second ends attached to respective bonding finger, wherein a number of the voltage reference conductors are conductive straps surrounded by dams of insulating material; and a passivation envelope encapsulating the semiconductor device, signal connection conductors, voltage reference conductors, and bonding fingers on the substrate. - View Dependent Claims (11, 12, 13, 14, 15)
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16. A method for providing enhanced conductors in a package containing a semiconductor device chip, the method comprising:
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selecting a suitable package substrate and bond finger combination; defining voltage reference locations on selected bond fingers; determining which signal pins have insulation; defining patterns on a mask for printing strap trenches and defining the strap trenches on the package substrate; depositing conductive material to fill in the strap trenches; bonding the signal pins with insulated/non-insulated wires as has been previously determined; sealing the insulated signal wires at their respective ends at the respective bond pads and bond fingers with an insulating material; and encapsulating the semiconductor device chip in a passivating envelope.
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Specification