LIGHT EMITTING DEVICE HAVING FUNCTION OF HEAT-DISSIPATION AND MANUFACTURING PROCESS FOR SUCH DEVICE
First Claim
1. A light-emitting device, comprising:
- a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface;
a plurality of conductors, each disposed in the through hole respectively;
a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material;
a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface, the top surface facing the second surface of the post-like metal material;
at least one light-emitting diode disposed on the first surface of the post-like metal material and having electrodes;
a plurality of wires, one end of each wire being electrically connected to the corresponding electrode of the light-emitting diode; and
an encapsulating material, covering the first surface of the post-like metal material,wherein one end of each conductor is electrically connected with the corresponding electrode of the printed circuit board and the other end of each conductor is electrically connected with the corresponding wire.
1 Assignment
0 Petitions
Accused Products
Abstract
A light-emitting device of a light-emitting diode (LED) and a manufacture method thereof are provided. The light-emitting device includes a post-like metal material, a printed circuit board, conductors, insulators, light-emitting diodes, wires, and an encapsulating material. The light-emitting device has through holes, in which conductors are disposed and surrounded with the insulators. One end of each conductor is connected to the printed circuit board to form a composite structure heat-dissipation substrate. The light-emitting diodes are disposed on the post-like metal material, connected to the conductors via the wires, and encapsulated by the encapsulating material. Furthermore, the light-emitting diodes, the wires, and the encapsulating material can be combined into a light-emitting unit. Moreover, red, blue, and green light-emitting diodes can be combined and the color of output light thereof can be adjusted by controlling the input signal.
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Citations
28 Claims
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1. A light-emitting device, comprising:
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a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface; a plurality of conductors, each disposed in the through hole respectively; a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material; a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface, the top surface facing the second surface of the post-like metal material; at least one light-emitting diode disposed on the first surface of the post-like metal material and having electrodes; a plurality of wires, one end of each wire being electrically connected to the corresponding electrode of the light-emitting diode; and an encapsulating material, covering the first surface of the post-like metal material, wherein one end of each conductor is electrically connected with the corresponding electrode of the printed circuit board and the other end of each conductor is electrically connected with the corresponding wire. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A light-emitting device, comprising:
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a post-like metal material, having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and second surface; a plurality of conductors, each disposed in the through hole respectively; a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material; a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface, the top surface facing the second surface of the post-like metal material; and at least one light-emitting unit disposed on the first surface of the post-like metal material, the light-emitting unit including; a substrate being an insulator and having a first surface, a through hole and an electrical circuit on the first surface; a post-like heat-dissipation base disposed in the through hole of the substrate, and having a top surface and a bottom surface attached to the first surface of the post-like metal material; at least one light-emitting diode attached to the top surface of the heat-dissipation base; a plurality of wires electrically connecting the light-emitting diode to the electrical circuit on the substrate; two electrode terminals, one end of each electrode terminal being connected to the electrical circuit on the substrate, wherein one end of each conductor is electrically connected with the corresponding electrode of the printed circuit board and the other end of each conductor is electrically connected with the corresponding electrode terminal; and an encapsulating material covering the first surface of the substrate. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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23. A manufacturing method of a light-emitting device, the manufacturing method comprising:
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providing a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface; providing a plurality of post-like conductors, each surrounded with an insulator and disposed in the through hole respectively; providing a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface; facing the second surface of the post-like metal material to the top surface of the printed circuit board, and electrically connecting one end of each conductor to the corresponding electrode; providing at least one light-emitting diode including electrodes, and attaching the light-emitting diode to the post-like metal material; providing a plurality of wires, wherein one end of each wire is electrically connected to the corresponding electrode of the light-emitting diode, and the other end of each conductor is electrically connected with the corresponding wire; and providing an encapsulating material for covering the first surface of the post-like metal material. - View Dependent Claims (24)
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25. A manufacturing method of a light-emitting device, the manufacturing method comprising:
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providing a post-like metal material having a first surface and a second surface, and provided with a plurality of through holes communicating the first surface and the second surface; providing a plurality of post-like conductors, each disposed in the through hole respectively; providing a plurality of insulators, each disposed in the through hole respectively and insulating the corresponding conductor from the post-like metal material; performing a high-temperature sintering process to integrate the conductors, the insulators, and the post-like metal material as a whole; providing a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface; facing the second surface of the post-like metal material to the top surface of the printed circuit board, and electrically connecting one end of each conductor to the corresponding electrode; providing at least one light-emitting diode including electrodes, and attaching the light-emitting diode to the post-like metal material; providing a plurality of wires, wherein one end of each wire is electrically connected to the corresponding electrode of the light-emitting diode, and the other end of each conductor is electrically connected with the corresponding wire; and providing an encapsulating material for covering the first surface of the post-like metal material. - View Dependent Claims (26)
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27. A manufacturing method of a light-emitting device, the manufacturing method comprising:
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providing a post-like metal material having a first surface and a second surface, and provided with a ring groove on the first surface, a part of the post-like metal material surrounded by the ring groove forming a conductor; providing an insulator to fill the ring groove; performing a high-temperature sintering process to integrate the conductor, the insulator, and the post-like metal material as a whole; decreasing the thickness of the post-like metal material by grinding, scraping, or digging the post-like metal material along the direction from the second surface to the first surface to expose the conductor and the insulator from the second surface; providing a printed circuit board having a top surface and a plurality of electrodes disposed on the top surface; facing the second surface of the post-like metal material to the top surface of the printed circuit board and electrically connecting one end of the conductor to the corresponding electrode; providing at least one light-emitting diode including electrodes, and attaching the light-emitting diode to the post-like metal material; providing a plurality of wires, wherein one end of each wire is electrically connected to the corresponding electrode of the light-emitting diode, and the other end of the conductor is electrically connected with the corresponding wire; and providing an encapsulating material for covering the first surface of the post-like metal material. - View Dependent Claims (28)
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Specification