MECHANICAL ISOLATION FOR MEMS DEVICES

• US 20090166827A1
• Filed: 12/27/2007
• Published: 07/02/2009
• Est. Priority Date: 12/27/2007
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Eskridge, Mark, Foster, Michael, Zhou, Shifang, Jafri, Ijaz
• Granted Patent: US 7,830,003 B2
• Time in Patent Office: Days
• US Class Current: 257/676
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 7/0048 between the MEMS die and the substrate
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A device according to the present invention includes a MEMS device supported on a first side of a die. A first side of an isolator is attached to the first side of the die. A package is attached to the first side of the isolator, with at least one electrically conductive attachment device attaching the die to the isolator and attaching the isolator to the package. The isolator may include isolation structures and a receptacle.

Claims

1. A device comprising:

a microelectromechanical systems (MEMS) device;

a die configured to support the MEMS device on a first side of the die;

an isolator with a first side attached to the first side of the die;

a package attached to the first side of the isolator; and

an electrically conductive attachment device configured to attach the die to the isolator and to attach the isolator to the package.

2. The device of claim 1, further including a top cover attached to the die.

3. The device of claim 2, wherein the isolator further includes a receptacle formed through a thickness of the isolator, the receptacle sized and shaped to allow insertion of the top cover through the receptacle.

4. The device of claim 1, wherein the isolator includes isolation structures.

5. The device of claim 4, wherein the isolation structures include at least one of tines formed through a thickness of the isolator and shock stops.

6. The device of claim 1, wherein the isolator further includes an angled shelf on the first side of the isolator.

7. The device of claim 1, wherein the package includes a stepped recess sized and shaped to accommodate the isolator, the die, and the MEMS device.

8. The device of claim 7 wherein the package further includes a wirebond shelf, and the isolator is attached to the wirebond shelf.

9. The device of claim 6 wherein when the isolator is attached to the package, a portion of the angled shelf is in contact with the package.

10. The device of claim 1 wherein the attachment device includes at least one of gold bumps, solder balls, conductive polymers, and directional conductors.

11. A method comprising:

attaching a MEMS device to a first side of a die;

attaching a first side of an isolator to the first side of the die;

attaching the first side of the isolator to a package.

12. The method of claim 11 including:

attaching a top cover to the first side of the die.

13. The method of claim 11 including:

forming a receptacle in the isolator sized and shaped to allow insertion of a top cover through the receptacle.

14. The method of claim 11 including:

forming at least one isolation structure in the isolator.

15. The method of claim 11 including:

forming one of tines through a thickness of the isolator and shock stops.

16. The method of claim 11 including:

forming an angled shelf on the first side of the isolator.

17. The method of claim 11 including:

forming a stepped recess in the package, the recess sized and shaped to accommodate the isolator, the die, and the MEMS device.

18. The method of claim 11 including:

attaching the isolator to a wirebond shelf of the package.

19. The method of claim 11 including:

making contact between an angled shelf of the isolator and the package.

20. The method of claim 11 including:

attaching the die to the isolator and attaching the isolator to the package using one of gold bumps, solder balls, conductive polymers, and directional conductors.