SEMICONDUCTOR DEVICE AND PROGRAMMING METHOD
First Claim
1. A method for fabricating a semiconductor device comprising:
- mounting a semiconductor chip on a chip mounting portion;
disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and
forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip.
6 Assignments
0 Petitions
Accused Products
Abstract
The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.
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Citations
27 Claims
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1. A method for fabricating a semiconductor device comprising:
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mounting a semiconductor chip on a chip mounting portion; disposing a sheet-shaped resin at a side of the semiconductor chip opposite to the chip mounting portion; and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (2, 3)
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4. The method as claimed in clam 1, wherein forming the resin sealing portion is forming the resin sealing portion by transfer molding.
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5. The method as claimed in clam 1, wherein the sheet-shaped resin does not include a filler.
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6. The method as claimed in clam 1, wherein forming the resin sealing portion includes partially forming the resin sealing portion between the sheet-shaped resin and the semiconductor chip.
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7. The method as claimed in clam 1, wherein disposing the sheet-shaped resin is disposing the sheet-shaped resin in contact with the semiconductor chip.
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8. The method as claimed in clam 1, wherein the semiconductor chip has stacked semiconductor chips.
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9. The method as claimed in clam 1, further comprising:
coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.
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10. The method as claimed in clam 1 further comprising:
coupling a wire between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.
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11. A wireless communications device, comprising:
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a memory comprising; a semiconductor chip; a chip mounting portion mounting the semiconductor chip; a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; and a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; a processor; a communications component; a transmitter; a receiver; and an antenna connected to the transmitter circuit and the receiver circuit. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A computing device comprising:
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a processor; an input component; an output component; a memory comprising; a semiconductor chip; a chip mounting portion mounting the semiconductor chip; a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; and a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (18, 19, 20, 21, 22)
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23. A portable media player comprising:
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a processor; a cache; a user input component; a coder-decoder component; and a memory comprising; a semiconductor chip; a chip mounting portion mounting the semiconductor chip; a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; and a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip. - View Dependent Claims (24, 25, 26, 27)
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Specification