WIRELESS IC DEVICE

• US 20090277967A1
• Filed: 07/28/2009
• Published: 11/12/2009
• Est. Priority Date: 04/27/2007
• Status: Active Grant

• Current Assignee: Murata Manufacturing Co Limited
• Original Assignee: Murata Manufacturing Co Limited
• Inventors: Ikemoto, Nobuo, Dokai, Yuya, Kato, Noboru
• Granted Patent: US 8,632,014 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole

Abstract

A wireless IC device includes a radiating plate, a wireless IC chip, and a feeder circuit board, on which the wireless IC chip is mounted. The feeder circuit board includes a resonant circuit with an inductance element, and the resonant circuit is electromagnetically coupled with the radiating plate. The wireless IC chip is interposed between the radiating plate and the feeder circuit board.

Claims

1. A wireless IC device comprising:

a radiating plate;

a wireless IC chip; and

a feeder circuit board on which the wireless IC chip is mounted, the feeder circuit board including a feeder circuit having a resonant circuit, the feeder circuit being coupled with the radiating plate;

wherein

the wireless IC chip is interposed between the radiating plate and the feeder circuit board.

2. The wireless IC device according to claim 1, wherein the radiating plate and the feeder circuit board are joined to each other at a periphery of the wireless IC chip when viewed in a direction perpendicular or substantially perpendicular to a surface of the feeder circuit board on which the wireless IC chip is mounted.

3. The wireless IC device according to claim 1, wherein the radiating plate is adhered to an article at a surface remote from the feeder circuit board and the wireless IC chip.

4. The wireless IC device according to claim 1, further comprising:

a resin component disposed between the radiating plate and the feeder circuit board at at least the periphery of the wireless IC chip when viewed in the direction perpendicular or substantially perpendicular to the surface of the feeder circuit board on which the wireless IC chip is mounted.

5. The wireless IC device according to claim 1, wherein the wireless IC chip is electrically insulated from the radiating plate.

6. The wireless IC device according to claim 1, wherein at least one of the radiating plate and the feeder circuit board is made of a flexible substrate.

7. The wireless IC device according to claim 1, wherein the wireless IC chip is in contact with the radiating plate at a surface remote from the feeder circuit board.

8. The wireless IC device according to claim 1, wherein the feeder circuit is electrically coupled with the radiating plate.

9. The wireless IC device according to claim 1, wherein the feeder circuit is magnetically coupled with the radiating plate.

10. The wireless IC device according to claim 1, wherein the feeder circuit is electrically and magnetically coupled with the radiating plate.

11. The wireless IC device according to claim 1, wherein the resonant circuit includes one of an inductance element or a matching circuit.

12. The wireless IC device according to claim 1, wherein the resonant circuit includes an inductance element and a matching circuit.