GROOVE ON COVER PLATE OR SUBSTRATE
First Claim
1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:
- providing a transparent substrate comprising a first MEMS device and a second MEMS device formed thereon;
providing a cover plate, wherein at least one of the cover plate or the substrate includes a groove on an inside face;
orienting the cover plate or substrate so that the groove is located in an area between the first and second MEMS devices;
joining the cover plate to the substrate to form a first package around the first MEMS device and a second package around the second MEMS device;
applying a force between the first and second packages, wherein the force propagates a crack along the groove; and
separating the first and second packages.
2 Assignments
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Accused Products
Abstract
An improved substrate or cover plate design with a groove for effective singulation of individual display apparatus. In one embodiment, the display apparatus comprises a prefabricated groove on an inside face of a substrate or cover plate to facilitate separation of a MEMS device from a plurality of MEMS devices formed a substrate. In some embodiments, the prefabricated grooves make breaking at pseudo scribe lines simple by thinning and weakening the substrate or cover plate at a scribe zone and act as an improved guide for breaking. Scribe cut relief preserves components, structural integrity, and produces a clean break without inducing excessive or unwanted stresses into the MEMS core and ensures no damage at the panel ledge for subsequent interconnect assembly.
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Citations
32 Claims
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1. A method of manufacturing a microelectromechanical systems (MEMS) based display device, the method comprising:
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providing a transparent substrate comprising a first MEMS device and a second MEMS device formed thereon; providing a cover plate, wherein at least one of the cover plate or the substrate includes a groove on an inside face; orienting the cover plate or substrate so that the groove is located in an area between the first and second MEMS devices; joining the cover plate to the substrate to form a first package around the first MEMS device and a second package around the second MEMS device; applying a force between the first and second packages, wherein the force propagates a crack along the groove; and separating the first and second packages. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A microelectromechanical systems (MEMS) based device, comprising:
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a transparent substrate comprising a first MEMS device and a second MEMS device formed thereon; a cover plate joined to the substrate to form a first package around the first MEMS device and a second package around the second MEMS device; and a groove on an inside face of at least one of the cover plate or the substrate, wherein the groove is between the first and second MEMS devices, wherein an inside face of the cover plate faces an inside face of the substrate, wherein the groove on the inside face of at least one of the cover plate or the substrate reduces a strength of the cover plate or substrate. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A microelectromechanical systems (MEMS) based device, comprising:
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a transparent substrate supporting a first MEMS device and a second MEMS device formed thereon; a cover plate for covering the first and second MEMS devices; and means for weakening the substrate or the cover plate, wherein the weakening means is located in an area between the first and second MEMS devices, wherein the cover plate is coupled to the substrate to form a first package around the first MEMS device and a second package around the second MEMS device. - View Dependent Claims (30, 31, 32)
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Specification