BASE FOR POWER MODULE
First Claim
1. A power module base comprising:
- a heat radiation substrate formed of a high-thermal-conduction material;
an insulating substrate joined to one surface of the heat radiation substrate;
a wiring layer provided on a surface of the insulating substrate opposite the side where the insulating substrate is joined to the heat radiation substrate; and
a heat radiation fin joined to the other surface of the heat radiation substrate, whereina component attachment plate which is thicker than the heat radiation substrate and has a through hole for accommodating the insulating substrate is joined to the surface of the heat radiation substrate, to which surface the insulating substrate is joined, such that the insulating substrate is located within the through hole.
1 Assignment
0 Petitions
Accused Products
Abstract
A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.
-
Citations
16 Claims
-
1. A power module base comprising:
-
a heat radiation substrate formed of a high-thermal-conduction material;
an insulating substrate joined to one surface of the heat radiation substrate;a wiring layer provided on a surface of the insulating substrate opposite the side where the insulating substrate is joined to the heat radiation substrate; and a heat radiation fin joined to the other surface of the heat radiation substrate, wherein a component attachment plate which is thicker than the heat radiation substrate and has a through hole for accommodating the insulating substrate is joined to the surface of the heat radiation substrate, to which surface the insulating substrate is joined, such that the insulating substrate is located within the through hole. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
Specification