VOID-FREE IMPLANTABLE HERMETICALLY SEALED STRUCTURES
First Claim
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1. An implantable hermetically sealed structure comprising a conformal sealing layer over at least a portion of the outer surface of said structure to provide an implantable hermetically sealed structure.
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Accused Products
Abstract
An implantable integrated circuit structure comprising a conformal thin-film sealing layer for hermetically sealing circuitry layers is provided. Also disclosed are electrode structures, leads that include the same, implantable pulse generators that include the leads, as well as systems and kits having components thereof, other implantable devices utilizing the structures, and methods of making and using the subject structures.
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Citations
24 Claims
- 1. An implantable hermetically sealed structure comprising a conformal sealing layer over at least a portion of the outer surface of said structure to provide an implantable hermetically sealed structure.
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10. A method of fabricating an implantable hermetically sealed integrated circuit, said method comprising:
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providing a circuitry layer on a top surface of a substrate; and producing a sealing layer on a top surface of said circuitry layer that hermetically seals said circuitry layer to provide said implantable hermetically sealed integrated circuit device. - View Dependent Claims (11, 12, 13)
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Specification